MT41K256M16TW-107 AUT

Orderable parts

MT41K256M16TW-107 AUT:P

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    4Gb
  • FBGA Code
    D9TRN
  • Features
  • Op. Temp.
    -40C to +125C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

4Gb: x8, x16 Automotive DDR3L SDRAM

MT41K512M8: 64 Meg x 8 x 8 banks, MT41K256M16: 32 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2018-02-14T06:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2019

Simulation Models

HSpice

2.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2016-01-28T00:00:00.0000000Z

IBIS

2.0 (Die Rev.P)
  • File Type: ZIP
  • Updated: 2016-01-28T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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