MT47H1G4WTR-25E

Orderable parts

MT47H1G4WTR-25E:C

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-800
  • Density
    4Gb
  • FBGA Code
    D9NKH
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-47-08: DDR2 Package Sizes and Layout Requirements

This technical note covers DDR2 package sizes and layout requirements.
  • File Type: PDF
  • Updated: 2005-11-16
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Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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