MT47H128M8CF-25E

Orderable parts

MT47H128M8CF-25E:H

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-800
  • Density
    1Gb
  • FBGA Code
    D9LHQ
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

1Gb: x4, x8, x16 DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-25

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30

Simulation Models

HSpice

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-01-25

IBIS

2.5 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2013-08-05

1024Mb DDR2 Verilog Model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-47-20: DDR2 (Point-to-Point) Package Sizes and Layout Basics

This technical note provides general guidelines for developing the PCB floor plan with DDR2 SDRAM.
  • File Type: PDF
  • Updated: 2007-06-16
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Customer Service Notes

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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