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Data Sheet Uploaded 01/2016

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Package Block Diagrams

Package Block Diagrams

Figure 1. Single-Rank, Dual-Die, Single-Channel Package Block Diagram


Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. This data sheet contains initial characterization limits that are subject to change upon full characterization of production devices.

Package Dimensions

Package Dimensions

Figure 1. 168-Ball PoP FBGA (12mm x 12mm) – EDB8132B4PB-8D-F-D/R



Notes

  1. Package drawing: ECA-TS2-0515-02.

  2. All dimensions are in millimeters.

Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. This data sheet contains initial characterization limits that are subject to change upon full characterization of production devices.

Revision History

Revision History

Rev. B – 7/14


  • Updated resistors in Package Block Diagram

Rev. A – 4/14


  • Initial release

Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. This data sheet contains initial characterization limits that are subject to change upon full characterization of production devices.