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MT35XU01GBBA1G12-0SIT

Data Sheets (1)

Specs

Orderable Parts for: MT35XU01GBBA1G12-0SIT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT35XU01GBBA1G12-0SIT Sampling N/A RW265 N/A N/A No N/A
Detailed Specifications
Density 1Gb Part Status Sampling Width x1/x8 Voltage 1.7V-2.0V
Package T-PBGA Pin Count 24-ball Speed 200 MHz RoHS Yes
Op Temp -40C to +85C Part Family MT35X Interface Xccela Bus Type Octal I/O
Config x1 Boot

Sim Models & Software

Sim Models
Verilog

Verilog model_Octal Serial NOR

  • File Type: GZ
  • Updated: 10/12/2017
IBIS

x.1= 1, 2. TT= IT, AT, AUT.

  • File Type: ZIP
  • Updated: 10/05/2017
Software
Software Driver

General low-level driver for MT35X. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 11/02/2015

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All Xccela Flash Documentation
Technical Notes
Search (3) Xccela Flash Technical Notes
Technical Notes


(TN-25-38) This technical note provides direction on how to properly apply and remove the power supply to a NOR Flash device from the MT25Q, MT25T, and MT35X families.

  • File Type: PDF
  • Updated: 12/14/2017
Technical Notes


(TN-25-08) This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.

  • File Type: PDF
  • Updated: 09/12/2017
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Technical Notes


(TN-25-08) This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.

  • File Type: PDF
  • Updated: 09/12/2017
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018

Parts with the same Data Sheet (3)

MT35XU01GBBA1G12-0SIT ( Current ) MT35XU01GBBA2G12-0SIT MT35XU01GBBA1G12-0AAT MT35XU01GBBA2G12-0AAT
Part Status Sampling Sampling Sampling Sampling
Density 1Gb 1Gb 1Gb 1Gb
Width x1/x8 x1/x8 x1/x8 x1/x8
Voltage 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V
Package T-PBGA T-PBGA T-PBGA T-PBGA
Pin Count 24-ball 24-ball 24-ball 24-ball
Speed 200 MHz 200 MHz 200 MHz 200 MHz
RoHS Yes Yes Yes Yes
Op Temp -40C to +85C -40C to +85C -40C to +105C -40C to +105C
Part Family MT35X MT35X MT35X MT35X
Interface Xccela Bus Xccela Bus Xccela Bus Xccela Bus
Type Octal I/O Octal I/O Octal I/O Octal I/O
Config x1 Boot x8 Boot x1 Boot x8 Boot

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT35XU01GBBA1G12-0SIT Sampling N/A RW265 N/A N/A No N/A
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