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MT35XL01GBBA2G12-0SIT

Data Sheets (1)

Specs

Orderable Parts for: MT35XL01GBBA2G12-0SIT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT35XL01GBBA2G12-0SIT Sampling N/A RW268 N/A N/A No N/A
Detailed Specifications
Density 1Gb Part Status Sampling Width x1/x8 Voltage 2.7V-3.6V
Package T-PBGA Pin Count 24-ball Speed 133 MHz RoHS Yes
Op Temp -40C to +85C Part Family MT35X Interface Xccela Bus Type Octal I/O

Sim Models & Software

Sim Models
IBIS

x.1= 1, 2. TT= IT, AT, AUT.

  • File Type: ZIP
  • Updated: 10/05/2017
Software
Software Driver

General low-level driver for MT35X. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 11/02/2015

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 11/2017
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2017

Documentation & Support

See All Xccela Flash Documentation
Technical Notes
Search (3) Xccela Flash Technical Notes
Technical Notes


(TN-25-08) This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.

  • File Type: PDF
  • Updated: 09/12/2017
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Technical Notes


(TN-25-08) This technical note discusses how a single 24-ball BGA package (6 x 8 mm) can support a variety of flash products, enabling designers to offer a range of densities, features and performance levels simply by replacing the installed flash device.

  • File Type: PDF
  • Updated: 09/12/2017
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Search (3) Xccela Flash Technical Notes

Parts with the same Data Sheet (1)

MT35XL01GBBA2G12-0SIT ( Current ) MT35XL01GBBA1G12-0SIT
Part Status Sampling Sampling
Density 1Gb 1Gb
Width x1/x8 x1/x8
Voltage 2.7V-3.6V 2.7V-3.6V
Package T-PBGA T-PBGA
Pin Count 24-ball 24-ball
Speed 133 MHz 133 MHz
RoHS Yes Yes
Op Temp -40C to +85C -40C to +85C
Part Family MT35X MT35X
Interface Xccela Bus Xccela Bus
Type Octal I/O Octal I/O

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT35XL01GBBA2G12-0SIT Sampling N/A RW268 N/A N/A No N/A
Contact Your Sales Rep
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