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X28F320C3BD70C

Specs

Orderable Parts for: X28F320C3BD70C
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
X28F320C3BD70C Obsolete N/A N/A N/A N/A N/A N/A N/A
Detailed Specifications
Density 32Mb Part Status Obsolete Width x16 Voltage 2.7V-3.6V
Package Die Pin Count n/a Speed 70ns RoHS Yes
Op Temp -40C to +85C Applications Embedded Part Family C3 Configuration Top Boot

Sim Models & Software

Software
Software Driver

General low-level driver for C3 parallel NOR.

  • File Type: ZIP
  • Updated: 04/05/2005

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (38) Parallel NOR Flash Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
X28F320C3BD70C Obsolete N/A N/A N/A N/A N/A N/A N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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