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TE28F320B3TD70A

Specs

Orderable Parts for: TE28F320B3TD70A
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
TE28F320B3TD70A Obsolete N/A N/A N/A N/A N/A N/A N/A
Detailed Specifications
Density 32Mb Part Status Obsolete Width x16 Voltage 2.7V-3.6V
Package TSOP Pin Count 48-pin Speed 70ns RoHS No
Op Temp -40C to +85C Applications Embedded Part Family B3 Configuration Top Boot

Sim Models & Software

Software
Software Support Pack

For some Norflashes,the size of the buffer program has been increased from 256 bytes to 512 bytes,2ms maximum timeout can not adapt to all the different vendor's norflash.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

This patch try to put read operation at head of write operation in nor_erase_prepare(), read out the data.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

Micron Nor flash don't support read operation after send write command.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Driver

General low-level driver for 128Mb, 256Mb, and 512Mb M29W parallel NOR.

  • File Type: ZIP
  • Updated: 02/24/2014
Software Driver

Software Driver file for M29W640F/M29W064F (64Mb)

  • File Type: ZIP
  • Updated: 04/04/2013

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (38) Parallel NOR Flash Technical Notes
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Technical Notes


(TN-13-50) This technical note describes the process for converting a system design from the Micron M29W devices to MT28EW single-level cell NOR Flash devices, including 128Mb and 256Mb densities.

  • File Type: PDF
  • Updated: 02/10/2017
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
TE28F320B3TD70A Obsolete N/A N/A N/A N/A N/A N/A N/A
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