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Data Sheets (1)

Data Sheet
256Mb, 65nm Embedded Parallel NOR Flash
  • File Type: PDF
  • Updated: 02/2011


Orderable Parts for: TE28F256J3F105A
Status Media FBGA Code SPD Data Chipset
PLP Start Date Alternative Part
TE28F256J3F105A Obsolete N/A N/A N/A N/A N/A N/A N/A
Detailed Specifications
Density 256Mb Part Status Obsolete Width x8/x16 Voltage 2.7V-3.6V
Package TSOP Pin Count 56-pin Speed 105ns RoHS No
Op Temp -40C to +85C Applications Embedded Part Family J3 Configuration Uniform

Sim Models & Software

Sim Models
Software Driver

Enhanced driver for J3, J3vD, P30 and P33 parallel NOR. Download the user guide for the EFD here.

  • File Type: ZIP
  • Updated: 11/30/2009

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (38) Parallel NOR Flash Technical Notes
Technical Notes

(TN-12-50) Software driver for J3F parallel NOR Flash memory. Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 01/28/2013
Technical Notes

(TN-12-06) This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.

  • File Type: PDF
  • Updated: 10/17/2011
Technical Notes

(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes

(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Customer Service Notes
Customer Service Note

(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018
Customer Service Note

(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (2)

TE28F256J3F105A ( Current ) PC28F256J3F95A RC28F256J3F95A
Part Status Obsolete Contact Factory Contact Factory
Density 256Mb 256Mb 256Mb
Width x8/x16 x8/x16 x8/x16
Voltage 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V
Package TSOP Easy BGA Easy BGA
Pin Count 56-pin 64-ball 64-ball
Speed 105ns 95ns 95ns
RoHS No Yes No
Op Temp -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded
Part Family J3 J3 J3
Configuration Uniform Uniform Uniform

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
PLP Start Date Alternative Part
TE28F256J3F105A Obsolete N/A N/A N/A N/A N/A N/A N/A
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