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PC28F640P33BF60D

Data Sheets (2)

Addendum
This document will explain how the standard One Time Programmable (OTP) Protection Registers may optionally be used to protect data in the Main Memory Array.
  • File Type: PDF
  • Updated: 03/2013

Specs

Orderable Parts for: PC28F640P33BF60D
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
PC28F640P33BF60D Obsolete Dry Pack N/A N/A N/A No N/A
Detailed Specifications
Density 64Mb Part Status Obsolete Width x16 Voltage 2.3V-3.6V
Package Easy BGA Pin Count 64-ball Speed 60ns RoHS Yes
Op Temp -40C to +85C Applications Embedded Part Family P33 Configuration Bottom Boot, OTP

Sim Models & Software

Sim Models
Software
Software Driver

Enhanced driver for J3, J3vD, P30 and P33 parallel NOR. Download the user guide for the EFD here.

  • File Type: ZIP
  • Updated: 11/30/2009

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 10/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 10/2018

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (38) Parallel NOR Flash Technical Notes
Technical Notes


(TN-12-06) This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.

  • File Type: PDF
  • Updated: 10/17/2011
Technical Notes


(TN-12-05) This document describes a method of password protecting blocks using Micron's M29EW device, as an example.

  • File Type: PDF
  • Updated: 03/11/2011
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (8)

PC28F640P33BF60D ( Current ) PC28F256P30BFR PC28F256P30BFP PC28F128P30BF65E JS28F640P30BF75D PC28F256P33BFR PC28F256P33BFP PC28F128P33BF60D PC28F128P33TF60B
Part Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete End of Life Obsolete
Density 64Mb 256Mb 256Mb 128Mb 64Mb 256Mb 256Mb 128Mb 128Mb
Width x16 x16 x16 x16 x16 x16 x16 x16 x16
Voltage 2.3V-3.6V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V
Package Easy BGA Easy BGA Easy BGA Easy BGA TSOP Easy BGA Easy BGA Easy BGA Easy BGA
Pin Count 64-ball 64-ball 64-ball 64-ball 56-pin 64-ball 64-ball 64-ball 64-ball
Speed 60ns 100ns 100ns 65ns 75ns 85ns 85ns 60ns 60ns
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes
Op Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded
Part Family P33 P30 P30 P30 P30 P33 P33 P33 P33
Configuration Bottom Boot, OTP Bottom Boot, OTP Bottom Boot, OTP Bottom Boot, OTP Bottom Boot, OTP Bottom Boot, OTP Bottom Boot, OTP Bottom Boot, OTP Top Boot, OTP

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
PC28F640P33BF60D Obsolete Dry Pack N/A N/A N/A No N/A
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