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PC28F00AP30BFA

Data Sheets (1)

Data Sheet
65nm; MLC; 28F512P30B/E/TF, 28F00AP30B/E/TF, 28F00BP30EF
  • File Type: PDF
  • Updated: 05/2017

Specs

Orderable Parts for: PC28F00AP30BFA
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
PC28F00AP30BFA Contact Factory Dry Pack N/A N/A N/A No N/A
Detailed Specifications
Density 1Gb Part Status Contact Factory Width x16 Voltage 1.7V-2.0V
Package Easy BGA Pin Count 64-ball Speed 100ns RoHS Yes
Op Temp -40C to +85C Applications Embedded Part Family P30 Configuration Bottom Boot

Sim Models & Software

Sim Models
Verilog

P30_Verilog, 1Gb, 65nm, v1.7

  • File Type: GZ
  • Updated: 10/09/2012
Software
Software Driver

Enhanced driver for J3, J3vD, P30 and P33 parallel NOR. Download the user guide for the EFD here.

  • File Type: ZIP
  • Updated: 11/30/2009

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 09/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2018

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (38) Parallel NOR Flash Technical Notes
Technical Notes


(TN-12-06) This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.

  • File Type: PDF
  • Updated: 10/17/2011
Technical Notes


(TN-12-05) This document describes a method of password protecting blocks using Micron's M29EW device, as an example.

  • File Type: PDF
  • Updated: 03/11/2011
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Technical Notes


(TN-13-50) This technical note describes the process for converting a system design from the Micron M29W devices to MT28EW single-level cell NOR Flash devices, including 128Mb and 256Mb densities.

  • File Type: PDF
  • Updated: 02/10/2017
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (11)

PC28F00AP30BFA ( Current ) PC28F00AP30EFA PC28F00AP30TFA PC28F00BP30EFA PC28F512P30BFA PC28F512P30BFB PC28F512P30EFA PC28F512P30TFA PC28F512P30TFB RC28F00AP30BFA RC28F00AP30TFA PC28F512P30EFB
Part Status Contact Factory End of Life End of Life End of Life End of Life End of Life End of Life End of Life End of Life Obsolete Obsolete End of Life
Density 1Gb 1Gb 1Gb 2Gb 512Mb 512Mb 512Mb 512Mb 512Mb 1Gb 1Gb 512Mb
Width x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16
Voltage 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-3.6V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V 1.7V-2.0V
Package Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA
Pin Count 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball
Speed 100ns 100ns 100ns 105ns 100ns 100ns 100ns 100ns 100ns 100ns 100ns 100ns
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes No No Yes
Op Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded
Part Family P30 P30 P30 P30 P30 P30 P30 P30 P30 P30 P30 P30
Configuration Bottom Boot Uniform Top Boot Uniform Bottom Boot Bottom Boot Uniform Top Boot Top Boot Bottom Boot Top Boot

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
PC28F00AP30BFA Contact Factory Dry Pack N/A N/A N/A No N/A
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