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M29W640FB70N6E

Data Sheets (1)

Data Sheet
64Mb (8Mb x8 or 4Mb x16), 3V, Page, Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 01/2016

Specs

Orderable Parts for: M29W640FB70N6E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
M29W640FB70N6E Production Dry Pack N/A N/A N/A No N/A
Detailed Specifications
Density 64Mb Part Status Production Width x8/x16 Voltage 2.7V-3.6V
Package TSOP Pin Count 48-pin Speed 70ns RoHS Yes
Op Temp -40C to +85C Applications Embedded Part Family M29W Configuration Bottom Boot
Media Tray Product Grouping

Sim Models & Software

Sim Models
Verilog

M29W640F, 64Mb

  • File Type: ZIP
  • Updated: 04/04/2013
Software
Software Driver

Software Driver file for M29W640F/M29W064F (64Mb)

  • File Type: ZIP
  • Updated: 04/04/2013
Software Driver

General low-level driver for M29W F parallel NOR.

  • File Type: ZIP
  • Updated: 05/09/2006

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (37) Parallel NOR Flash Technical Notes
Technical Notes


(TN-13-43) Password access is a security enhancement in 65nm M29EW, P30, P33, and J3 devices. This technical note explains how this feature protects main-array memory block information by preventing READ, WRITE, or PROGRAM operations until a valid 64-bit password is entered.

  • File Type: PDF
  • Updated: 07/22/2016
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Technical Notes


(TN-1322) Explains how to convert a system design.

  • File Type: PDF
  • Updated: 08/06/2015
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Search (37) Parallel NOR Flash Technical Notes

Parts with the same Data Sheet (7)

M29W640FB70N6E ( Current ) M29W640FT70ZA6F M29W640FT70ZA6E M29W640FT70N6F M29W640FT70N6E M29W640FB70ZA6F M29W640FB70ZA6E M29W640FB70N6F
Part Status Production Obsolete Production Obsolete Contact Factory Production Production Contact Factory
Density 64Mb 64Mb 64Mb 64Mb 64Mb 64Mb 64Mb 64Mb
Width x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16
Voltage 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V
Package TSOP TFBGA TFBGA TSOP TSOP TFBGA TFBGA TSOP
Pin Count 48-pin 48-ball 48-ball 48-pin 48-pin 48-ball 48-ball 48-pin
Speed 70ns 70ns 70ns 70ns 70ns 70ns 70ns 70ns
RoHS Yes Yes Yes Yes Yes Yes Yes Yes
Op Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded
Part Family M29W M29W M29W M29W M29W M29W M29W M29W
Configuration Bottom Boot Top Boot Top Boot Top Boot Top Boot Bottom Boot Bottom Boot Bottom Boot
Media Tray Tape & Reel Tray Tape & Reel Tray Tape & Reel Tray Tape & Reel
Product Grouping

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
M29W640FB70N6E Production Dry Pack N/A N/A N/A No N/A
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