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JS28F00AP33TFA

Data Sheets (1)

Data Sheet
512Mb, 1Gb, 2Gb, 65nm, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 12/2013

Specs

Orderable Parts for: JS28F00AP33TFA
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
JS28F00AP33TFA Contact Factory Dry Pack N/A N/A N/A No View

Compare

Compare MT28EW01GABA1HJS-0SIT
(Recommended Part)
JS28F00AP33TFA
Part Status Contact Factory Production Contact Factory
Density 1Gb 1Gb 1Gb
Width x16 x8/x16 x16
Voltage 2.3V-3.6V 2.7V-3.6V 2.3V-3.6V
Package TSOP TSOP TSOP
Pin Count 56-pin 56-pin 56-pin
Speed 105ns 75ns 105ns
RoHS Yes Yes Yes
Op Temp -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded
Part Family P33 EW-Series P33
Configuration Top Boot High Lock Top Boot
Media Tray Tray
Product Grouping P3x P3x
Detailed Specifications
Density 1Gb Part Status Contact Factory Width x16 Voltage 2.3V-3.6V
Package TSOP Pin Count 56-pin Speed 105ns RoHS Yes
Op Temp -40C to +85C Applications Embedded Part Family P33 Configuration Top Boot
Media Tray Product Grouping P3x

Sim Models & Software

Sim Models
Software
Software Driver

Enhanced driver for J3, J3vD, P30 and P33 parallel NOR. Download the user guide for the EFD here.

  • File Type: ZIP
  • Updated: 11/30/2009

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All Parallel NOR Flash Documentation
Technical Notes
Search (37) Parallel NOR Flash Technical Notes
Technical Notes


(TN-12-06) This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.

  • File Type: PDF
  • Updated: 10/17/2011
Technical Notes


(TN-12-05) This document describes a method of password protecting blocks using Micron's M29EW device, as an example.

Technical Notes


(TN-13-43) Password access is a security enhancement in 65nm M29EW, P30, P33, and J3 devices. This technical note explains how this feature protects main-array memory block information by preventing READ, WRITE, or PROGRAM operations until a valid 64-bit password is entered.

  • File Type: PDF
  • Updated: 07/22/2016
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Technical Notes


(TN-1322) Explains how to convert a system design.

  • File Type: PDF
  • Updated: 08/06/2015
Technical Notes


(TN-12-30) This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.

Search (37) Parallel NOR Flash Technical Notes

Parts with the same Data Sheet (12)

JS28F00AP33TFA ( Current ) JS28F00AP33BFA JS28F00AP33EFA JS28F512P33BFD JS28F512P33EFA JS28F512P33TFA PC28F00AP33BFA PC28F00AP33EFA PC28F00AP33TFA PC28F512P33BFD PC28F512P33EFA PC28F512P33TFA PC28F00BP33EFA
Part Status Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Obsolete
Density 1Gb 1Gb 1Gb 512Mb 512Mb 512Mb 1Gb 1Gb 1Gb 512Mb 512Mb 512Mb 2Gb
Width x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16
Voltage 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.3V-3.6V 2.7V-3.6V
Package TSOP TSOP TSOP TSOP TSOP TSOP Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA Easy BGA
Pin Count 56-pin 56-pin 56-pin 56-pin 56-pin 56-pin 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball
Speed 105ns 105ns 105ns 105ns 105ns 105ns 95ns 95ns 95ns 95ns 95ns 95ns 100ns
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Op Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded Embedded
Part Family P33 P33 P33 P33 P33 P33 P33 P33 P33 P33 P33 P33 P33
Configuration Top Boot Bottom Boot Uniform Bottom Boot Uniform Top Boot Bottom Boot Uniform Top Boot Bottom Boot Uniform Top Boot Top/Bottom Boot
Media Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray Tray
Product Grouping P3x P3x P3x P3x P3x P3x P3x P3x P3x P3x P3x P3x P3x

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
JS28F00AP33TFA Contact Factory Dry Pack N/A N/A N/A No View

Compare

Compare MT28EW01GABA1HJS-0SIT
(Recommended Part)
JS28F00AP33TFA
Part Status Contact Factory Production Contact Factory
Density 1Gb 1Gb 1Gb
Width x16 x8/x16 x16
Voltage 2.3V-3.6V 2.7V-3.6V 2.3V-3.6V
Package TSOP TSOP TSOP
Pin Count 56-pin 56-pin 56-pin
Speed 105ns 75ns 105ns
RoHS Yes Yes Yes
Op Temp -40C to +85C -40C to +85C -40C to +85C
Applications Embedded Embedded Embedded
Part Family P33 EW-Series P33
Configuration Top Boot High Lock Top Boot
Media Tray Tray
Product Grouping P3x P3x
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