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MT29F64G08CBABAWP

Data Sheets (1)

Data Sheet
L84A NAND datasheet 64Gb to 256Gb NAND Flash device
  • File Type: PDF
  • Updated: 12/2013

Specs

Orderable Parts for: MT29F64G08CBABAWP
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F64G08CBABAWP:B Production N/A N/A N/A N/A No N/A
Detailed Specifications
Density 64Gb Status Production NAND Type 2D RoHS Yes
Width x8 Voltage 3.3V Package TSOP Pin Count 48-pin
Op. Temp. 0C to +70C MT/s I/O Common Product Name

Sim Models & Software

Sim Models
Verilog

64/128/256/512Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 01/10/2014
HSpice
  • File Type: ZIP
  • Updated: 09/19/2012
IBIS
  • File Type: ZIP
  • Updated: 09/19/2012
Software
Software Support Pack

MLC NANDs have more bit flips that SLC. When looking for bad block marker we have a lot of false positive if we check for the whole byte. To avoid this tolerate a few (4 here) bit flips for byte.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

For MLC NAND, paired page issue is now a common known issue. This patch is just for master node cannot be recovered while there will two pages be dameged in one single master block.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

These patches aim to solve MLC NAND paired page power loss issue by adding a bakvol (backup volume) module in UBI layer. 70 series and 80 series families.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 05/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 05/2016

Documentation & Support

See All MLC NAND Documentation
Technical Notes
Search (4) MLC NAND Technical Notes
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-29-65) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 10/15/2010
Technical Notes


(TN-29-61) This technical note describes the recommended wear leveling algorithm to be implemented in the FTL software for NAND Flash memory.

  • File Type: PDF
  • Updated: 10/15/2010
Search (4) MLC NAND Technical Notes

Parts with the same Data Sheet (19)

MT29F64G08CBABAWP ( Current ) MT29F64G08CBABAL84A3WC1 MT29F128G08CFABAWP MT29F64G08CBABBWP MT29F256G08CJABAWP MT29F256G08CJABBWP-12 MT29F128G08CECBBH1-10 MT29F256G08CMCBBH2-10 MT29F256G08CKCBBH2-10 MT29F64G08CBCBBH1-10 MT29F128G08CECBBH1-10IT MT29F256G08CMCBBH2-10IT MT29F64G08CBEBBL84A3WC1 MT29F128G08CFABAWP-IT MT29F128G08CFABBWP-12 MT29F128G08CFABBWP-12IT MT29F256G08CJABAWP-IT MT29F256G08CJABBWP-12IT MT29F64G08CBABAWP-IT MT29F64G08CBABBWP-12IT
Status Production Production Production Production Production Production Production Production End of Life Production Production Production Production Production Production Production End of Life Production Production Production
Density 64Gb 64Gb 128Gb 64Gb 256Gb 256Gb 128Gb 256Gb 256Gb 64Gb 128Gb 256Gb 64Gb 128Gb 128Gb 128Gb 256Gb 256Gb 64Gb 64Gb
NAND Type 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D 2D
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Width x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Package TSOP Wafer TSOP TSOP TSOP TSOP VBGA TBGA TBGA VBGA VBGA TBGA Wafer TSOP TSOP TSOP TSOP TSOP TSOP TSOP
Pin Count 48-pin n/a 48-pin 48-pin 48-pin 48-pin 100-ball 100-ball 100-ball 100-ball 100-ball 100-ball n/a 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin
Op. Temp. 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C -40C to +85C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
MT/s n/a 166 MT/s 200 MT/s 166 MT/s 166 MT/s 166 MT/s 200 MT/s 200 MT/s n/a 166 MT/s 166 MT/s 166 MT/s 166 MT/s
I/O Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common
Product Name

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F64G08CBABAWP:B Production N/A N/A N/A N/A No N/A
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