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MT29F32G08CBACAL73A3WC1

Data Sheets (1)

Die Data Sheet
  • File Type: PDF
  • Updated: 07/2015

Specs

Orderable Parts for: MT29F32G08CBACAL73A3WC1
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F32G08CBACAL73A3WC1 Contact Factory N/A N/A N/A N/A No View

Compare

Compare MT29F32G08CBADAL83A3WC1
(Recommended Part)
MT29F32G08CBACAL73A3WC1
Status Contact Factory Production Contact Factory
Density 32Gb 32Gb 32Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package Wafer Die Wafer
Pin Count n/a n/a n/a
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
MT/s
I/O Common Common Common
Product Name
MT29F32G08CBACAL73A3WC1P Contact Factory N/A N/A N/A N/A No View

Compare

Compare MT29F32G08CBADAL83A3WC1
(Recommended Part)
MT29F32G08CBACAL73A3WC1P
Status Contact Factory Production Contact Factory
Density 32Gb 32Gb 32Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package Wafer Die Wafer
Pin Count n/a n/a n/a
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
MT/s
I/O Common Common Common
Product Name
Detailed Specifications
Density 32Gb Status Contact Factory NAND Type 2D RoHS Yes
Width x8 Voltage 3.3V Package Wafer Pin Count n/a
Op. Temp. 0C to +70C MT/s I/O Common Product Name

Sim Models & Software

Sim Models
Verilog

32/64/128/256Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 08/30/2012
HSpice
  • File Type: ZIP
  • Updated: 01/13/2012
IBIS
  • File Type: ZIP
  • Updated: 01/13/2012

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 02/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 02/2016

Documentation & Support

See All MLC NAND Documentation
Technical Notes
Search (3) MLC NAND Technical Notes
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-29-61) This technical note describes the recommended wear leveling algorithm to be implemented in the FTL software for NAND Flash memory.

  • File Type: PDF
  • Updated: 10/15/2010
Search (3) MLC NAND Technical Notes

Parts with the same Data Sheet (1)

MT29F32G08CBACAL73A3WC1 ( Current ) MT29F32G08CBECBL73A3WC1
Status Contact Factory End of Life
Density 32Gb 32Gb
NAND Type 2D 2D
RoHS Yes Yes
Width x8 x8
Voltage 3.3V 3.3V
Package Wafer Wafer
Pin Count n/a n/a
Op. Temp. 0C to +70C 0C to +70C
MT/s
I/O Common Common
Product Name

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F32G08CBACAL73A3WC1 Contact Factory N/A N/A N/A N/A No View

Compare

Compare MT29F32G08CBADAL83A3WC1
(Recommended Part)
MT29F32G08CBACAL73A3WC1
Status Contact Factory Production Contact Factory
Density 32Gb 32Gb 32Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package Wafer Die Wafer
Pin Count n/a n/a n/a
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
MT/s
I/O Common Common Common
Product Name
MT29F32G08CBACAL73A3WC1P Contact Factory N/A N/A N/A N/A No View

Compare

Compare MT29F32G08CBADAL83A3WC1
(Recommended Part)
MT29F32G08CBACAL73A3WC1P
Status Contact Factory Production Contact Factory
Density 32Gb 32Gb 32Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package Wafer Die Wafer
Pin Count n/a n/a n/a
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
MT/s
I/O Common Common Common
Product Name
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