logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

NAND512R3A2SZA6E

Specs

Orderable Parts for: NAND512R3A2SZA6E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
NAND512R3A2SZA6E Production Dry Pack N/A N/A N/A No N/A
Detailed Specifications
Density 512Mb Status Production Width x8 Voltage 1.8V
Package VFBGA Pin Count 63-ball MT/s Op Temp -40C to +85C

Sim Models & Software

Sim Models
Software
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

NANDcode is a "C" FTL (Flash Translation Layer) software library for ARM platform.

  • File Type: ZIP
  • Updated: 08/08/2014
Software Driver

M60A, M61A, M62B, M68A, M68M, M70M, M71M, M72A, M73A, M79M. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 04/05/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 09/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2018

Documentation & Support

See All SLC NAND Documentation
Technical Notes
Search (17) SLC NAND Technical Notes
Technical Notes


(TN-26-03) This technical note explains how to read, program, and manage small page NAND memory.

  • File Type: PDF
  • Updated: 08/16/2016
Technical Notes


(TN-29-62) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 04/24/2017
Technical Notes


(TN-13-49) This technical note discusses the adverse effects of high temperature and PROGRAM/ ERASE (P/E) cycles on flash memory data retention and how the REFRESH operation can be used to mitigate these adverse effects.

  • File Type: PDF
  • Updated: 10/31/2016
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (6)

NAND512R3A2SZA6E ( Current ) NAND512W3A2SZA6E NAND512W3A2SN6F NAND512W3A2SZA6F NAND512W3A2SNXE NAND512R3A2SZAXE NAND512R3A2SZA6F
Status Production End of Life Production Production Production Contact Factory Obsolete
Density 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb
Width x8 x8 x8 x8 x8 x8 x8
Voltage 1.8V 3.0V 3.0V 3.0V 3.3V 3.3V 3.3V
Package VFBGA VFBGA TSOP VFBGA TSOP VFBGA VFBGA
Pin Count 63-ball 63-ball 48-ball 63-ball 48-pin 63-ball 63-ball
MT/s
Op Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
NAND512R3A2SZA6E Production Dry Pack N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors