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NAND256W3A2BN6F

Specs

Orderable Parts for: NAND256W3A2BN6F
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
NAND256W3A2BN6F Production Tape & Reel N/A N/A N/A No N/A
Detailed Specifications
Density 256Mb Status Production Width x8 Voltage 3.0V
Package TSOP Pin Count 48-pin MT/s Op Temp -40C to +85C

Sim Models & Software

Sim Models
Verilog

256Mb, 3V, TSOP, 48 pin, x8

  • File Type: ZIP
  • Updated: 01/20/2014
Software
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

NANDcode is a "C" FTL (Flash Translation Layer) software library for ARM platform.

  • File Type: ZIP
  • Updated: 08/08/2014
Software Driver

M60A, M61A, M62B, M68A, M68M, M70M, M71M, M72A, M73A, M79M. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 04/05/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 07/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 07/2018

Documentation & Support

See All SLC NAND Documentation
Technical Notes
Search (17) SLC NAND Technical Notes
Technical Notes


(TN-29-62) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 04/24/2017
Technical Notes


(TN-13-49) This technical note discusses the adverse effects of high temperature and PROGRAM/ ERASE (P/E) cycles on flash memory data retention and how the REFRESH operation can be used to mitigate these adverse effects.

  • File Type: PDF
  • Updated: 10/31/2016
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (7)

NAND256W3A2BN6F ( Current ) NAND128W3A0BN6E NAND128W3A2BN6E NAND256W3A0BN6E NAND256W3A2BZA6E NAND256W3A0BN6F NAND256W3A2BZAXE NAND256W3A2BZA6F
Status Production Obsolete Production Obsolete End of Life Contact Factory Production Production
Density 256Mb 128Mb 128Mb 256Mb 256Mb 256Mb 256Mb 256Mb
Width x8 x8 x8 x8 x8 x8 x8 x8
Voltage 3.0V 3.0V 3.0V 3.0V 3.0V 3.0V 3.3V 3.0V
Package TSOP TSOP TSOP TSOP VFBGA TSOP VFBGA WFBGA
Pin Count 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin 55-ball 48-pin
MT/s
Op Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
NAND256W3A2BN6F Production Tape & Reel N/A N/A N/A No N/A
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Check with Distributors
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