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MT29F64G08EBAAAB74A3WC1

Data Sheets (1)

Die Data Sheet
Datasheet: NAND Die 64Gb MLCx3 B74A
  • File Type: PDF
  • Updated: 10/2012

Specs

Orderable Parts for: MT29F64G08EBAAAB74A3WC1
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F64G08EBAAAB74A3WC1 Obsolete N/A N/A N/A N/A No View

Compare

Compare MT29F64G08EBAAAB74A3WC1P
(Recommended Part)
MT29F64G08EBAAAB74A3WC1
Status Obsolete End of Life Obsolete
Density 64Gb 64Gb 64Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package Wafer Wafer Wafer
Pin Count n/a n/a n/a
MT/s n/a n/a n/a
I/O Common Common Common
Detailed Specifications
Density 64Gb Status Obsolete NAND Type 2D RoHS Yes
Width x8 Voltage 3.3V Package Wafer Pin Count n/a
MT/s n/a I/O Common

Sim Models & Software

Sim Models
Verilog

64/128/256Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 08/30/2012

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All TLC NAND Documentation
Technical Notes
Search (2) TLC NAND Technical Notes
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Search (2) TLC NAND Technical Notes

Parts with the same Data Sheet (3)

MT29F64G08EBAAAB74A3WC1 ( Current ) MT29F64G08EBAABB74A3WC1 MT29F64G08EBEABB74A3WC1P MT29F64G08EBAAAB74A3WC1P
Status Obsolete Obsolete Obsolete End of Life
Density 64Gb 64Gb 64Gb 64Gb
NAND Type 2D 2D 2D 2D
RoHS Yes Yes Yes Yes
Width x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V
Package Wafer Wafer Die Wafer
Pin Count n/a n/a n/a n/a
MT/s n/a n/a
I/O Common Common Common Common

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F64G08EBAAAB74A3WC1 Obsolete N/A N/A N/A N/A No View

Compare

Compare MT29F64G08EBAAAB74A3WC1P
(Recommended Part)
MT29F64G08EBAAAB74A3WC1
Status Obsolete End of Life Obsolete
Density 64Gb 64Gb 64Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package Wafer Wafer Wafer
Pin Count n/a n/a n/a
MT/s n/a n/a n/a
I/O Common Common Common
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