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MT29F2G08ABAEAWP-IT

Data Sheets (1)

Data Sheet
  • File Type: PDF
  • Updated: 04/2014

Specs

Orderable Parts for: MT29F2G08ABAEAWP-IT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2G08ABAEAWP-IT:E Production N/A N/A N/A N/A No N/A
Detailed Specifications
Density 2Gb Status Production RoHS Yes Width x8
Voltage 3.3V Package TSOP Pin Count 48-pin MT/s
I/O Common Op Temp -40C to +85C

Sim Models & Software

Sim Models
HSpice
  • File Type: ZIP
  • Updated: 10/01/2014
IBIS
  • File Type: ZIP
  • Updated: 10/01/2014
Verilog

2Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 08/21/2012
Software
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

NANDcode is a "C" FTL (Flash Translation Layer) software library for ARM platform.

  • File Type: ZIP
  • Updated: 08/08/2014
Software Driver

M60A, M61A, M62B, M68A, M68M, M70M, M71M, M72A, M73A, M79M. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 04/05/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All SLC NAND Documentation
Technical Notes
Search (17) SLC NAND Technical Notes
Technical Notes


(TN-29-51) This technical note supplements the product change notification (PCN) covering the transition from Micron® 50-series (50nm) to 60-series (34nm) single-level cell (SLC) NAND Flash devices.

  • File Type: PDF
  • Updated: 08/16/2016
Technical Notes


(TN-13-49) This technical note discusses the adverse effects of high temperature and PROGRAM/ ERASE (P/E) cycles on flash memory data retention and how the REFRESH operation can be used to mitigate these adverse effects.

  • File Type: PDF
  • Updated: 10/31/2016
Technical Notes


(TN-29-58) This technical note explains the device features that enable NV-DDR2 and provides guidelines for system designs to enable I/O transfer rates of up to 400 MT/s using the NV-DDR2 interface.

  • File Type: PDF
  • Updated: 09/29/2016
Technical Notes


(TN-29-51) This technical note supplements the product change notification (PCN) covering the transition from Micron® 50-series (50nm) to 60-series (34nm) single-level cell (SLC) NAND Flash devices.

  • File Type: PDF
  • Updated: 08/16/2016
Technical Notes


(TN-29-76) This technical note describes the block lock feature on Micron's MT29F NAND Flash memory devices.

  • File Type: PDF
  • Updated: 08/16/2016
Technical Notes


(TN-26-03) This technical note explains how to read, program, and manage small page NAND memory.

  • File Type: PDF
  • Updated: 08/16/2016
Search (17) SLC NAND Technical Notes

Parts with the same Data Sheet (21)

MT29F2G08ABAEAWP-IT ( Current ) MT29F2G08ABAEAH4 MT29F2G08ABAEAH4-IT MT29F2G08ABAEAM69A3WC1 MT29F2G08ABAEAWP MT29F2G08ABBEAH4 MT29F2G08ABBEAH4-IT MT29F2G08ABBEAHC MT29F2G08ABBEAHC-IT MT29F2G08ABBEAM69A3WC1 MT29F2G16ABAEAM69A3WC1 MT29F2G16ABAEAWP MT29F2G16ABAEAWP-IT MT29F2G16ABBEAH4 MT29F2G16ABBEAH4-IT MT29F2G16ABBEAHC MT29F2G16ABBEAHC-IT MT29F2G16ABBEAM69A3WC1 MT29F2G08ABAEAWP-ITX MT29F2G08ABAEAH4-ITX MT29F2G08ABBEAH4-ITX MT29F2G08ABAEAWP-AT
Status Production Production Production Contact Factory Production Production Production Production Production Contact Factory Obsolete Production Production Production Production Production Production Contact Factory Production Production Production Contact Factory
Density 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Width x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x16 x16 x16 x16 x16 x16 x16 x16 x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 1.8V 1.8V 1.8V 1.8V 1.8V 3.3V 3.3V 3.3V 1.8V 1.8V 1.8V 1.8V 1.8V 3.3V 3.3V 1.8V 3.3V
Package TSOP VFBGA VFBGA Wafer TSOP VFBGA VFBGA VFBGA VFBGA Wafer Wafer TSOP TSOP VFBGA VFBGA VFBGA VFBGA Wafer TSOP VFBGA VFBGA TSOP
Pin Count 48-pin 63-ball 63-ball n/a 48-pin 63-ball 63-ball 63-ball 63-ball n/a n/a 48-pin 48-pin 63-ball 63-ball 63-ball 63-ball n/a 48-pin 63-ball 63-ball 48-pin
MT/s
I/O Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common
Op Temp -40C to +85C 0C to +70C -40C to +85C 0C to +70C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C -40C to +85C -40C to +85C 0C to +70C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2G08ABAEAWP-IT:E Production N/A N/A N/A N/A No N/A
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