logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT29F2G08AABWP-ET

Data Sheets (1)

Specs

Orderable Parts for: MT29F2G08AABWP-ET
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2G08AABWP-ET Obsolete N/A N/A N/A N/A No N/A
Detailed Specifications
Density 2Gb Status Obsolete Width x8 Voltage 3.3V
Package TSOP Pin Count 48-pin MT/s Op Temp -40C to +85C

Sim Models & Software

Sim Models
Verilog

3.3

  • File Type: ZIP
  • Updated: 01/11/2007
Software
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

NANDcode is a "C" FTL (Flash Translation Layer) software library for ARM platform.

  • File Type: ZIP
  • Updated: 08/08/2014
Software Driver

M60A, M61A, M62B, M68A, M68M, M70M, M71M, M72A, M73A, M79M. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 04/05/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All SLC NAND Documentation
Technical Notes
Search (17) SLC NAND Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-29-62) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 04/24/2017
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (7)

MT29F2G08AABWP-ET ( Current ) MT29F2G08AABWP MT29F2G16AABWP MT29F4G08BABWP MT29F4G08BABWP-ET MT29F4G16BABWP MT29F8G08FABWP MT29F8G08FABWP-ET
Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Density 2Gb 2Gb 2Gb 4Gb 4Gb 4Gb 8Gb 8Gb
Width x8 x8 x16 x8 x8 x16 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Package TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP
Pin Count 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin
MT/s
Op Temp -40C to +85C 0C to +70C 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2G08AABWP-ET Obsolete N/A N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors