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MT29F256G08CECEBJ4-37ITR

Data Sheets (2)

Data Sheet
MT29F128G08CBCEB, MT29F256G08CECEB, MT29F512G08CMCEB
  • File Type: PDF
  • Updated: 10/2018
Errata
MT29F128G08CBCEB, MT29F256G08CECEB, MT29F512G08CMCEB
  • File Type: PDF
  • Updated: 03/2018

Specs

Orderable Parts for: MT29F256G08CECEBJ4-37ITR
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F256G08CECEBJ4-37ITR:E Production N/A NQ465 N/A N/A No N/A
Detailed Specifications
Density 256Gb Status Sampling NAND Type 3D Width x8
Voltage 3.3V Package VBGA Pin Count 132-ball Op. Temp. -40C to +85C
MT/s 533 MT/s Product Name

Sim Models & Software

Sim Models
HSpice
HSPICE (ZIP)

128Gb MLC Async/Sync NAND, L05B

  • File Type: ZIP
  • Updated: 02/09/2018
IBIS
IBIS (ZIP)

128Gb MLC Async/Sync NAND, L05B

  • File Type: ZIP
  • Updated: 02/09/2018
Sim Model

L05B NAND 128Gb Verilog model

  • File Type: ZIP
  • Updated: 11/21/2017
Software
Software Support Pack

MLC NANDs have more bit flips that SLC. When looking for bad block marker we have a lot of false positive if we check for the whole byte. To avoid this tolerate a few (4 here) bit flips for byte.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

For MLC NAND, paired page issue is now a common known issue. This patch is just for master node cannot be recovered while there will two pages be dameged in one single master block.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

These patches aim to solve MLC NAND paired page power loss issue by adding a bakvol (backup volume) module in UBI layer. 70 series and 80 series families.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016

Documentation & Support

See All MLC NAND Documentation
Technical Notes
Search (4) MLC NAND Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (2)

MT29F256G08CECEBJ4-37ITR ( Current ) MT29F128G08CBCEBJ4-37ITR MT29F512G08CMCEBJ4-37ITR
Status Sampling Sampling Sampling
Density 256Gb 128Gb 512Gb
NAND Type 3D 3D 3D
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package VBGA VBGA VBGA
Pin Count 132-ball 132-ball 132-ball
Op. Temp. -40C to +85C -40C to +85C -40C to +85C
MT/s 533 MT/s 533 MT/s 533 MT/s
Product Name

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F256G08CECEBJ4-37ITR:E Production N/A NQ465 N/A N/A No N/A
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