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MT29F256G08AUCABH3-10Z

Data Sheets (1)

Specs

Orderable Parts for: MT29F256G08AUCABH3-10Z
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F256G08AUCABH3-10Z:A Production N/A NW433 N/A N/A No N/A
Detailed Specifications
Density 256Gb Status Production Width x8 Voltage 3.3V
Package LBGA Pin Count 100-ball MT/s 200 MT/s Op Temp 0C to +70C

Sim Models & Software

Sim Models
Verilog

32/64/128/256Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 04/27/2017
IBIS
  • File Type: ZIP
  • Updated: 11/18/2016
HSpice
  • File Type: ZIP
  • Updated: 09/20/2010
Software
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

NANDcode is a "C" FTL (Flash Translation Layer) software library for ARM platform.

  • File Type: ZIP
  • Updated: 08/08/2014
Software Driver

M60A, M61A, M62B, M68A, M68M, M70M, M71M, M72A, M73A, M79M. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 04/05/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 09/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2018

Documentation & Support

See All SLC NAND Documentation
Technical Notes
Search (17) SLC NAND Technical Notes
Technical Notes


(TN-29-62) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 04/24/2017
Technical Notes


(TN-13-49) This technical note discusses the adverse effects of high temperature and PROGRAM/ ERASE (P/E) cycles on flash memory data retention and how the REFRESH operation can be used to mitigate these adverse effects.

  • File Type: PDF
  • Updated: 10/31/2016
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (6)

MT29F256G08AUCABH3-10Z ( Current ) MT29F32G08ABAAAWP-ITZ MT29F32G08ABCABH1-10Z MT29F128G08AJAAAWP-Z MT29F64G08AECABH1-10ITZ MT29F128G08AKCABH2-10 MT29F128G08AKCABH2-10IT
Status Production Production Production End of Life Production Production Production
Density 256Gb 32Gb 32Gb 128Gb 64Gb 128Gb 128Gb
Width x8 x8 x8 x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Package LBGA TSOP VBGA TSOP VBGA TBGA TBGA
Pin Count 100-ball 48-pin 100-ball 48-pin 100-ball 100-ball 100-ball
MT/s 200 MT/s 200 MT/s 200 MT/s 200 MT/s 200 MT/s
Op Temp 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F256G08AUCABH3-10Z:A Production N/A NW433 N/A N/A No N/A
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