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MT29F1G16ABBEAM68M3WC1

Data Sheets (2)

Data Sheet
Design Rev E; Data Sheet Rev N
  • File Type: PDF
  • Updated: 02/2018
Die Data Sheet
M68M Die datasheet
  • File Type: PDF
  • Updated: 04/2012

Specs

Orderable Parts for: MT29F1G16ABBEAM68M3WC1
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F1G16ABBEAM68M3WC1 Obsolete N/A N/A N/A N/A No N/A
Detailed Specifications
Density 1Gb Status Obsolete Width x16 Voltage 1.8V
Package Wafer Pin Count n/a MT/s Op Temp 0C to +70C

Sim Models & Software

Sim Models
IBIS
  • File Type: ZIP
  • Updated: 04/28/2014
Verilog

1Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 08/21/2012
HSpice
  • File Type: ZIP
  • Updated: 06/15/2012
Software
Software Driver

M60A, M61A, M62B, M68A, M68M, M70M, M71M, M72A, M73A, M79M. Download the technical note for this driver here.

  • File Type: ZIP
  • Updated: 04/05/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 09/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2018

Documentation & Support

See All SLC NAND Documentation
Technical Notes
Search (17) SLC NAND Technical Notes
Technical Notes


(TN-29-62) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 04/24/2017
Technical Notes


(TN-13-49) This technical note discusses the adverse effects of high temperature and PROGRAM/ ERASE (P/E) cycles on flash memory data retention and how the REFRESH operation can be used to mitigate these adverse effects.

  • File Type: PDF
  • Updated: 10/31/2016
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (6)

MT29F1G16ABBEAM68M3WC1 ( Current ) MT29F1G08ABAEAWP-IT MT29F1G08ABBEAH4-ITX MT29F1G16ABBEAH4-ITX MT29F1G08ABAEAWP-IT MT29F1G16ABBEAH4-ITX MT29F1G08ABBEAH4-ITX
Status Obsolete Production Production Production Production Production Production
Density 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb
Width x16 x8 x8 x16 x8 x16 x8
Voltage 1.8V 3.3V 1.8V 1.8V 3.3V 1.8V 1.8V
Package Wafer TSOP VFBGA VFBGA TSOP VFBGA VFBGA
Pin Count n/a 48-pin 63-ball 63-ball 48-pin 63-ball 63-ball
MT/s
Op Temp 0C to +70C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F1G16ABBEAM68M3WC1 Obsolete N/A N/A N/A N/A No N/A
Contact Your Sales Rep
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Check with Distributors
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