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MT29F128G08CBCABH6-6

Data Sheets (2)

Data Sheet
128/256/512Gb/1Tb, MLC, Async/Sync, L85A NAND
  • File Type: PDF
  • Updated: 03/2016
Errata
Errata 128/256/512Gb/1Tb, MLC, Async/Sync, L85A NAND
  • File Type: PDF
  • Updated: 10/2014

Specs

Orderable Parts for: MT29F128G08CBCABH6-6
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F128G08CBCABH6-6:A Contact Factory N/A NW385 N/A N/A No View

Compare

Compare MT29F128G08CBECBH6-12
(Recommended Part)
MT29F128G08CBCABH6-6:A
Status Contact Factory Production Contact Factory
Density 128Gb 128Gb 128Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package VBGA VBGA VBGA
Pin Count 152-ball 152-ball 152-ball
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
MT/s 333 MT/s 166 MT/s 333 MT/s
I/O Common Common Common
Product Name
Detailed Specifications
Density 128Gb Status Contact Factory NAND Type 2D RoHS Yes
Width x8 Voltage 3.3V Package VBGA Pin Count 152-ball
Op. Temp. 0C to +70C MT/s 333 MT/s I/O Common Product Name

Sim Models & Software

Sim Models
Verilog

128/256/512/1024Gb Verilog model Rev 7.30

  • File Type: ZIP
  • Updated: 07/17/2013
IBIS

128/256/512/1024Gb, MLC, Async/Sync, L85A NAND

  • File Type: ZIP
  • Updated: 05/28/2013
HSpice

128/256/512/1024Gb, MLC, Async/Sync, L85A NAND

  • File Type: ZIP
  • Updated: 05/28/2013
Software
Software Support Pack

MLC NANDs have more bit flips that SLC. When looking for bad block marker we have a lot of false positive if we check for the whole byte. To avoid this tolerate a few (4 here) bit flips for byte.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

Reset NAND before write protect check.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

For MLC NAND, paired page issue is now a common known issue. This patch is just for master node cannot be recovered while there will two pages be dameged in one single master block.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

These patches aim to solve MLC NAND paired page power loss issue by adding a bakvol (backup volume) module in UBI layer. 70 series and 80 series families.

  • File Type: ZIP
  • Updated: 03/31/2016
Software Support Pack

If the bitflips num over mtd->bitflip_threshold the mtd_read_oob will return -EUCLEAN and tags->ecc_result > YAFFS_ECC_RESULT_NO_ERROR. Then we will call yaffs_handle_chunk_error.

  • File Type: ZIP
  • Updated: 03/31/2016

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All MLC NAND Documentation
Technical Notes
Search (4) MLC NAND Technical Notes
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-29-65) Download the low-level driver described in this document here.

  • File Type: PDF
  • Updated: 10/15/2010
Technical Notes


(TN-29-61) This technical note describes the recommended wear leveling algorithm to be implemented in the FTL software for NAND Flash memory.

  • File Type: PDF
  • Updated: 10/15/2010
Search (4) MLC NAND Technical Notes

Parts with the same Data Sheet (1)

MT29F128G08CBCABH6-6 ( Current ) MT29F128G08CBCABL85A3WC1
Status Contact Factory Contact Factory
Density 128Gb 128Gb
NAND Type 2D 2D
RoHS Yes Yes
Width x8 x8
Voltage 3.3V 3.3V
Package VBGA Wafer
Pin Count 152-ball n/a
Op. Temp. 0C to +70C 0C to +70C
MT/s 333 MT/s
I/O Common Common
Product Name

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F128G08CBCABH6-6:A Contact Factory N/A NW385 N/A N/A No View

Compare

Compare MT29F128G08CBECBH6-12
(Recommended Part)
MT29F128G08CBCABH6-6:A
Status Contact Factory Production Contact Factory
Density 128Gb 128Gb 128Gb
NAND Type 2D 2D 2D
RoHS Yes Yes Yes
Width x8 x8 x8
Voltage 3.3V 3.3V 3.3V
Package VBGA VBGA VBGA
Pin Count 152-ball 152-ball 152-ball
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
MT/s 333 MT/s 166 MT/s 333 MT/s
I/O Common Common Common
Product Name
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