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MT29F768G08EECBBJ4-37

Data Sheets (1)

Data Sheet
B0KB 384Gb 768Gb 1T2 1HTb sync NAND datasheet
  • File Type: PDF
  • Updated: 12/2016

Specs

Orderable Parts for: MT29F768G08EECBBJ4-37
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F768G08EECBBJ4-37:B Production N/A NW838 N/A N/A No N/A
Detailed Specifications
Density 768Gb Status Production NAND Type 3D RoHS Yes
Width x8 Voltage 3.3V Package VBGA Pin Count 132-ball
MT/s 533 MT/s I/O Separate

Sim Models & Software

Sim Models
Sim Model

NAND 384/768/1536/3Tb/6Tb TLC B0KB Verilog model

  • File Type: ZIP
  • Updated: 12/05/2016
IBIS
B0KB IBIS (ZIP)

B0KB 384Gb 768Gb 1HTb 3Tb 6Tb sync NAND - IBIS Rev 2.0

  • File Type: ZIP
  • Updated: 12/01/2016
HSpice
B0KB HSPICE (ZIP)

B0KB 384Gb 768Gb 1HTb 3Tb 6Tb sync NAND - HSPICE Rev 2.0

  • File Type: ZIP
  • Updated: 12/01/2016

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All TLC NAND Documentation
Technical Notes
Search (2) TLC NAND Technical Notes
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Search (2) TLC NAND Technical Notes

Parts with the same Data Sheet (3)

MT29F768G08EECBBJ4-37 ( Current ) MT29F1HT08EMCBBJ4-37 MT29F384G08EBCBBJ4-37 MT29F1T208ECCBBJ4-37
Status Production Production Production Production
Density 768Gb 1Tb 384Gb 1Tb
NAND Type 3D 3D 3D 3D
RoHS Yes Yes Yes Yes
Width x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V
Package VBGA VBGA VBGA VBGA
Pin Count 132-ball 132-ball 132-ball 132-ball
MT/s 533 MT/s 533 MT/s 533 MT/s 533 MT/s
I/O Separate Separate Common Common

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F768G08EECBBJ4-37:B Production N/A NW838 N/A N/A No N/A
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