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MT29F768G08EECBBJ4-37

Specs

Orderable Parts for: MT29F768G08EECBBJ4-37
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F768G08EECBBJ4-37:B Production N/A NW838 N/A N/A No N/A
Detailed Specifications
Density 768Gb Status Production NAND Type 3D Width x8
Voltage 3.3V Package VBGA Pin Count 132-ball MT/s 533 MT/s

Sim Models & Software

Sim Models
Sim Model

NAND 384/768/1536/3Tb/6Tb TLC B0KB Verilog model

  • File Type: ZIP
  • Updated: 11/21/2017
HSpice
B0KB HSPICE (ZIP)

B0KB 384Gb 768Gb 1HTb 3Tb 6Tb sync NAND - HSPICE Rev 2.1

  • File Type: ZIP
  • Updated: 07/11/2017
IBIS
B0KB IBIS (ZIP)

B0KB 384Gb 768Gb 1HTb 3Tb 6Tb sync NAND - IBIS Rev 2.0

  • File Type: ZIP
  • Updated: 12/13/2016

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 09/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2018

Documentation & Support

See All TLC NAND Documentation
Technical Notes
Search (2) TLC NAND Technical Notes
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F768G08EECBBJ4-37:B Production N/A NW838 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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