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MT29F2T08EMHAFJ4-3R

Data Sheets (2)

Data Sheet
B17A FortisFlash customer datasheet
  • File Type: PDF
  • Updated: 07/2018
Data Sheet Variance
B17A FortisFlash TLC DSV
  • File Type: PDF
  • Updated: 11/2017

Specs

Orderable Parts for: MT29F2T08EMHAFJ4-3R
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2T08EMHAFJ4-3R:A Production N/A NW917 N/A N/A No N/A
Detailed Specifications
Density 2Tb Status Production NAND Type 3D Width x8
Voltage 3.3V Package VBGA Pin Count 132-ball MT/s 667 MT/s

Sim Models & Software

Sim Models
IBIS
IBIS (ZIP)

512Gb, 1T, 2T, 4T, 8T Async/Sync TLC NAND Flash - Rev 2.0

  • File Type: ZIP
  • Updated: 02/01/2018
HSpice
HSPICE (ZIP)

512Gb, 1T, 2T Async/Sync TLC NAND Flash - Rev 2.0

  • File Type: ZIP
  • Updated: 02/01/2018
Verilog


(B17A FortisFlash Verilog model) B17A FortisFlash Verilog model

  • File Type: ZIP
  • Updated: 11/21/2017

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All TLC NAND Documentation
Technical Notes
Search (2) TLC NAND Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-00-33) This technical note describes the new features in IBIS 5.0 enabling PI simulation. It also provides an overview of some of the modeling accuracy challenges and compares SSO simulation results using various electronic design automation (EDA) software tools.

  • File Type: PDF
  • Updated: 01/25/2016
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (4)

MT29F2T08EMHAFJ4-3R ( Current ) MT29F512G08EBHAFJ4-3R MT29F4T08EUHAFM4-3R MT29F8T08EWHAFJ6-3R MT29F512G08EBHAFB17A3WC1
Status Production Production Production Production Production
Density 2Tb 512Gb 4Tb 8Tb 512Gb
NAND Type 3D 3D 3D 3D 3D
Width x8 x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V
Package VBGA VBGA LBGA LBGA Wafer
Pin Count 132-ball 132-ball 132-ball 132-ball
MT/s 667 MT/s 667 MT/s 667 MT/s 667 MT/s

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2T08EMHAFJ4-3R:A Production N/A NW917 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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