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MT8LSDT3264HY-133

Data Sheets (1)

Specs

Orderable Parts for: MT8LSDT3264HY-133
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT8LSDT3264HY-133G1 EOL N/A N/A View N/A No N/A
Detailed Specifications
Technology SDRAM Density 256MB Part Status End of Life RoHS Yes
Comp Count 8 Depth 32Mb Width x64 Pin Count 144-pin
Op. Temp. 0C to +70C Data Rate Speed CL CL = 3
Voltage 3.3V Comp Config 16 Meg x 16 ECC Non ECC Module Rank Dual Rank
Register Part Type Standard

Sim Models & Software

Sim Models
IBIS
IBIS (ZIP)

  • File Type: ZIP
  • Updated: 03/12/2001

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All SODIMM Documentation
Technical Notes
Search (6) SODIMM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-04-42) This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.

  • File Type: PDF
  • Updated: 12/16/2009
Technical Notes


(TN-04-55) This technical note compares the most common DRAM module form factors.

  • File Type: PDF
  • Updated: 09/16/2009
Technical Notes


(TN-04-54) This technical note identifies and discusses five key areas of DRAM controller design.

  • File Type: PDF
  • Updated: 04/16/2008
Technical Notes


(TN-47-17) This technical note provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules.

  • File Type: PDF
  • Updated: 05/16/2005
Search (6) SODIMM Technical Notes

Parts with the same Data Sheet (2)

MT8LSDT3264HY-133 ( Current ) MT8LSDT3264HG-13E MT8LSDT3264HY-13E
Part Status End of Life Obsolete Obsolete
Technology SDRAM SDRAM SDRAM
Density 256MB 256MB 256MB
RoHS Yes 5/6 Yes
Comp Count 8 8 8
Depth 32Mb 32Mb 32Mb
Width x64 x64 x64
Pin Count 144-pin 144-pin 144-pin
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
Data Rate
Speed
CL CL = 3 CL = 2 CL = 2
Voltage 3.3V 3.3V 3.3V
Comp Config 16 Meg x 16 16 Meg x 16 16 Meg x 16
ECC Non ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register
Part Type Standard Standard Standard

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT8LSDT3264HY-133G1 EOL N/A N/A View N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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