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MT8LSDT3264HG-13E

Data Sheets (1)

Specs

Orderable Parts for: MT8LSDT3264HG-13E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT8LSDT3264HG-13ED2 Obsolete N/A N/A View N/A No View

Compare

Compare MT8LSDT3264HY-13E
(Recommended Part)
MT8LSDT3264HG-13ED2
Part Status Obsolete Obsolete Obsolete
Technology SDRAM SDRAM SDRAM
Density 256MB 256MB 256MB
RoHS 5/6 Yes 5/6
Comp Count 8 8 8
Depth 32Mb 32Mb 32Mb
Width x64 x64 x64
Pin Count 144-pin 144-pin 144-pin
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
Data Rate
Speed
CL CL = 2 CL = 2 CL = 2
Voltage 3.3V 3.3V 3.3V
Comp Config 16 Meg x 16 16 Meg x 16 16 Meg x 16
ECC Non ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register
Part Type Standard Standard Standard
Detailed Specifications
Technology SDRAM Density 256MB Part Status Obsolete RoHS 5/6
Comp Count 8 Depth 32Mb Width x64 Pin Count 144-pin
Op. Temp. 0C to +70C Data Rate Speed CL CL = 2
Voltage 3.3V Comp Config 16 Meg x 16 ECC Non ECC Module Rank Dual Rank
Register Part Type Standard

Sim Models & Software

Sim Models
Cadence DML
Cadence DML (ZIP)

  • File Type: ZIP
  • Updated: 03/12/2001
IBIS
IBIS (ZIP)

  • File Type: ZIP
  • Updated: 03/12/2001
Mentor ICX
MentorICX (ZIP)

  • File Type: ZIP
  • Updated: 03/12/2001

RoHS Certificates

RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All SODIMM Documentation
Technical Notes
Search (6) SODIMM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-04-42) This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.

  • File Type: PDF
  • Updated: 12/16/2009
Technical Notes


(TN-04-55) This technical note compares the most common DRAM module form factors.

  • File Type: PDF
  • Updated: 09/16/2009
Technical Notes


(TN-04-54) This technical note identifies and discusses five key areas of DRAM controller design.

  • File Type: PDF
  • Updated: 04/16/2008
Technical Notes


(TN-47-17) This technical note provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules.

  • File Type: PDF
  • Updated: 05/16/2005
Search (6) SODIMM Technical Notes

Parts with the same Data Sheet (2)

MT8LSDT3264HG-13E ( Current ) MT8LSDT3264HY-133 MT8LSDT3264HY-13E
Part Status Obsolete End of Life Obsolete
Technology SDRAM SDRAM SDRAM
Density 256MB 256MB 256MB
RoHS 5/6 Yes Yes
Comp Count 8 8 8
Depth 32Mb 32Mb 32Mb
Width x64 x64 x64
Pin Count 144-pin 144-pin 144-pin
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
Data Rate
Speed
CL CL = 2 CL = 3 CL = 2
Voltage 3.3V 3.3V 3.3V
Comp Config 16 Meg x 16 16 Meg x 16 16 Meg x 16
ECC Non ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register
Part Type Standard Standard Standard

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT8LSDT3264HG-13ED2 Obsolete N/A N/A View N/A No View

Compare

Compare MT8LSDT3264HY-13E
(Recommended Part)
MT8LSDT3264HG-13ED2
Part Status Obsolete Obsolete Obsolete
Technology SDRAM SDRAM SDRAM
Density 256MB 256MB 256MB
RoHS 5/6 Yes 5/6
Comp Count 8 8 8
Depth 32Mb 32Mb 32Mb
Width x64 x64 x64
Pin Count 144-pin 144-pin 144-pin
Op. Temp. 0C to +70C 0C to +70C 0C to +70C
Data Rate
Speed
CL CL = 2 CL = 2 CL = 2
Voltage 3.3V 3.3V 3.3V
Comp Config 16 Meg x 16 16 Meg x 16 16 Meg x 16
ECC Non ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register
Part Type Standard Standard Standard
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