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MT36KDZS2G72PDZ-1G4

Data Sheets (1)

Data Sheet
  • File Type: PDF
  • Updated: 04/2013

Specs

Orderable Parts for: MT36KDZS2G72PDZ-1G4
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT36KDZS2G72PDZ-1G4E1 Contact Factory N/A N/A View N/A No View

Compare

Compare MT36KDS2G72PDZ-1G4
(Recommended Part)
MT36KDZS2G72PDZ-1G4E1
Part Status Contact Factory Production Contact Factory
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 16GB 16GB 16GB
RoHS Green Green Green
Comp. Count 36 36 36
Depth 2Gb 2Gb 2Gb
Width x72 x72 x72
Pin Count 240-pin 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C 0C to +95C
Data Rate 1333 MT/s 1333 MT/s 1333 MT/s
Speed PC3-10600 PC3-10600 PC3-10600
CL CL = 9 CL = 9 CL = 9
Voltage 1.35V 1.35V 1.35V
Component Config 1Gb x 8 1Gb x 8 1Gb x 8
ECC ECC ECC ECC
Module Rank Dual Rank Quad Rank Dual Rank
Register Parity Parity Parity
Detailed Specifications
Technology DDR3 SDRAM Density 16GB Part Status Contact Factory RoHS Green
Comp. Count 36 Depth 2Gb Width x72 Pin Count 240-pin
Op Temp 0C to +95C Data Rate 1333 MT/s Speed PC3-10600 CL CL = 9
Voltage 1.35V Component Config 1Gb x 8 ECC ECC Module Rank Dual Rank
Register Parity

Sim Models & Software

Sim Models
IBIS
IBIS (ZIP)

D1

  • File Type: ZIP
  • Updated: 04/06/2012
IBIS
IBIS (ZIP)

E1

  • File Type: ZIP
  • Updated: 04/06/2012

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All VLP RDIMM Documentation
Technical Notes
Search (4) VLP RDIMM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-04-55) This technical note compares the most common DRAM module form factors.

  • File Type: PDF
  • Updated: 09/16/2009
Technical Notes


(TN-04-54) This technical note identifies and discusses five key areas of DRAM controller design.

  • File Type: PDF
  • Updated: 04/16/2008
Technical Notes


(TN-04-49) This technical note compares module parameters at different densities.

  • File Type: PDF
  • Updated: 03/16/2003
Search (4) VLP RDIMM Technical Notes

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT36KDZS2G72PDZ-1G4E1 Contact Factory N/A N/A View N/A No View

Compare

Compare MT36KDS2G72PDZ-1G4
(Recommended Part)
MT36KDZS2G72PDZ-1G4E1
Part Status Contact Factory Production Contact Factory
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 16GB 16GB 16GB
RoHS Green Green Green
Comp. Count 36 36 36
Depth 2Gb 2Gb 2Gb
Width x72 x72 x72
Pin Count 240-pin 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C 0C to +95C
Data Rate 1333 MT/s 1333 MT/s 1333 MT/s
Speed PC3-10600 PC3-10600 PC3-10600
CL CL = 9 CL = 9 CL = 9
Voltage 1.35V 1.35V 1.35V
Component Config 1Gb x 8 1Gb x 8 1Gb x 8
ECC ECC ECC ECC
Module Rank Dual Rank Quad Rank Dual Rank
Register Parity Parity Parity
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