Cookie Information

We use cookies to improve the website experience of our users. To learn more about our cookies, visit our Cookies Policy page.

logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT72HTS1G72FZ-667

Data Sheets (1)

Specs

Orderable Parts for: MT72HTS1G72FZ-667
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT72HTS1G72FZ-667H1D6 Obsolete N/A N/A View N/A No View

Compare

Compare MT72HTS1G72FZ-80E
(Recommended Part)
MT72HTS1G72FZ-667H1D6
Part Status Obsolete Obsolete
Technology DDR2 SDRAM DDR2 SDRAM
Density 8GB 8GB
Comp. Count 72 72
Depth 1Gb 1Gb
Width x72 x72
Pin Count 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C
Data Rate 667 MT/s 667 MT/s
Speed PC2-5300 PC2-5300
CL CL = 5 CL = 5
Voltage 1.8V 1.8V
Comp. Config 512 Meg x 4 512 Meg x 4
ECC ECC ECC
Module Rank Quad Rank Quad Rank
Register Non Parity Non Parity
Detailed Specifications
Technology DDR2 SDRAM Density 8GB Part Status Obsolete Comp. Count 72
Depth 1Gb Width x72 Pin Count 240-pin Op Temp 0C to +95C
Data Rate 667 MT/s Speed PC2-5300 CL CL = 5 Voltage 1.8V
Comp. Config 512 Meg x 4 ECC ECC Module Rank Quad Rank Register Non Parity

Sim Models & Software

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All FBDIMM Documentation
Technical Notes
Search (7) FBDIMM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-04-42) This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.

  • File Type: PDF
  • Updated: 12/16/2009
Technical Notes


(TN-47-21) This technical note provides an introduction to FBDIMM's high-speed link, explains what to expect in regard to channel bandwidth, and outlines how to optimize performance, including some power analysis techniques.

  • File Type: PDF
  • Updated: 12/16/2009
Technical Notes


(TN-04-55) This technical note compares the most common DRAM module form factors.

  • File Type: PDF
  • Updated: 09/16/2009
Technical Notes


(TN-47-22) This technical note discusses memory power trends and identifies new low-voltage solutions for high-density DDR2 memory designs.

  • File Type: PDF
  • Updated: 05/16/2008
Search (7) FBDIMM Technical Notes

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT72HTS1G72FZ-667H1D6 Obsolete N/A N/A View N/A No View

Compare

Compare MT72HTS1G72FZ-80E
(Recommended Part)
MT72HTS1G72FZ-667H1D6
Part Status Obsolete Obsolete
Technology DDR2 SDRAM DDR2 SDRAM
Density 8GB 8GB
Comp. Count 72 72
Depth 1Gb 1Gb
Width x72 x72
Pin Count 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C
Data Rate 667 MT/s 667 MT/s
Speed PC2-5300 PC2-5300
CL CL = 5 CL = 5
Voltage 1.8V 1.8V
Comp. Config 512 Meg x 4 512 Meg x 4
ECC ECC ECC
Module Rank Quad Rank Quad Rank
Register Non Parity Non Parity
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors