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MT38W2011A901ZQXZI

Data Sheets (3)

Data Sheet
JX68; MT38W1011A90YZQXZI.XB8, MT38W2011A90YZQXZI.X68, MT38W2011A901ZQXZI.X68, MT38W2011A501ZQXZI.X68
  • File Type: PDF
  • Updated: 09/2014
Data Sheet
TEMPORARY DATASHEET UNTIL MICRON BRANDED VERSION IS AVAILABLE - NDA REQUIRED
  • File Type: PDF
  • Updated: 04/2014
Data Sheet
M58WR032KT, M58WR064KT, M58WR032KB, M58WR064KB; used in Non-Mux 88-ball JX68, JX69, JXB8
  • File Type: PDF
  • Updated: 10/2011

Specs

Orderable Parts for: MT38W2011A901ZQXZI
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT38W2011A901ZQXZI.X68 Production N/A RC001 N/A N/A No N/A
Detailed Specifications
Part Status Production NOR Density 64Mb DRAM Type PSRAM (Async) DRAM Density 16Mb
Voltage 1.8V Package TFBGA Package Size 8 x 10 x 1.2 Pin Count 88-ball
Package Type Green Op. Temp. -40C to +85C NOR Family W-Series Configuration Top Boot
RoHS Yes

Sim Models & Software

Sim Models
IBIS

MT38W2011A901ZQXZI.X68, MT38W2011A501ZQXZI.X68.

  • File Type: ZIP
  • Updated: 06/18/2014

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NOR Based MCP Documentation
Technical Notes
Search (1) NOR Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Search (1) NOR Based MCP Technical Notes

Parts with the same Data Sheet (3)

MT38W2011A901ZQXZI ( Current ) MT38W2011A501ZQXZI MT38W1011A90YZQXZI MT38W2011A90YZQXZI
Part Status Production Production Production Production
NOR Density 64Mb 64Mb 32Mb 64Mb
DRAM Type PSRAM (Async) PSRAM (Async) PSRAM (Async) PSRAM (Async)
DRAM Density 16Mb 16Mb 16Mb 16Mb
Voltage 1.8V 1.8V 1.8V 1.8V
Package TFBGA TFBGA TFBGA TFBGA
Package Size 8 x 10 x 1.2 8 x 10 x 1.2 8 x 10 x 1.2 8 x 10 x 1.2
Pin Count 88-ball 88-ball 88-ball 88-ball
Package Type Green Green Green Green
Op. Temp. -40C to +85C -40C to +85C -40C to +85C -40C to +85C
NOR Family W-Series W-Series W-Series W-Series
Configuration Top Boot Bottom Boot Top Boot Top Boot
RoHS Yes Yes Yes Yes

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT38W2011A901ZQXZI.X68 Production N/A RC001 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
See All Distributors