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MT38W1011AA033JZZI

Data Sheets (3)

Data Sheet
JX68, JXB8; MT38W2011AA033JZZI.X68, MT38W1011AA033JZZI.XB8
  • File Type: PDF
  • Updated: 10/2015
Data Sheet
TEMPORARY DATASHEET UNTIL MICRON BRANDED VERSION IS AVAILABLE - NDA REQUIRED
  • File Type: PDF
  • Updated: 04/2014
Data Sheet
M58WR016KU, M58WR016KL, M58WR032KU, M58WR032KL, M58WR064KU, M58WR064KL; used in AD-mux 52-ball JX68, JX69, JXB8
  • File Type: PDF
  • Updated: 07/2011

Specs

Orderable Parts for: MT38W1011AA033JZZI
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT38W1011AA033JZZI.XB8 Production N/A RC003 N/A N/A No N/A
Detailed Specifications
Part Status Production NOR Density 32Mb DRAM Type PSRAM (Sync) DRAM Density 16Mb
Voltage 1.8V Package TFBGA Package Size 6 x 4 x 1 Pin Count 52-ball
Package Type Green Op. Temp. -40C to +85C NOR Family W-Series Configuration Top Boot
RoHS Yes

Sim Models & Software

Sim Models
IBIS

MT38W1011AA033JZZI.XB8

  • File Type: ZIP
  • Updated: 06/19/2014

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NOR Based MCP Documentation
Technical Notes
Search (1) NOR Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Search (1) NOR Based MCP Technical Notes

Parts with the same Data Sheet (1)

MT38W1011AA033JZZI ( Current ) MT38W2011AA033JZZI
Part Status Production Production
NOR Density 32Mb 64Mb
DRAM Type PSRAM (Sync) PSRAM (Sync)
DRAM Density 16Mb 16Mb
Voltage 1.8V 1.8V
Package TFBGA VFBGA
Package Size 6 x 4 x 1 6 x 4 x 1
Pin Count 52-ball 52-ball
Package Type Green Green
Op. Temp. -40C to +85C -40C to +85C
NOR Family W-Series W-Series
Configuration Top Boot Top Boot
RoHS Yes Yes

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT38W1011AA033JZZI.XB8 Production N/A RC003 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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