logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT38W1011A90YZQXZI

Data Sheets (1)

Data Sheet
JX68; MT38W1011A90YZQXZI.XB8, MT38W2011A90YZQXZI.X68, MT38W2011A901ZQXZI.X68, MT38W2011A501ZQXZI.X68
  • File Type: PDF
  • Updated: 09/2014

Specs

Orderable Parts for: MT38W1011A90YZQXZI
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT38W1011A90YZQXZI.XB8 Contact Factory N/A N/A N/A N/A No N/A
Detailed Specifications
Part Status Contact Factory NOR Density 32Mb DRAM Type PSRAM (Async) DRAM Density 16Mb
Voltage 1.8V Package TFBGA Package Size 8 x 10 x 1.2 Pin Count 88-ball
Package Type Green Op. Temp. -40C to +85C NOR Family W-Series Configuration Top Boot
RoHS Yes

Sim Models & Software

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 06/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 06/2018

Documentation & Support

See All NOR Based MCP Documentation
Technical Notes
Search (1) NOR Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (3)

MT38W1011A90YZQXZI ( Current ) MT38W2011A501ZQXZI MT38W2011A901ZQXZI MT38W2011A90YZQXZI
Part Status Contact Factory End of Life End of Life Contact Factory
NOR Density 32Mb 64Mb 64Mb 64Mb
DRAM Type PSRAM (Async) PSRAM (Async) PSRAM (Async) PSRAM (Async)
DRAM Density 16Mb 16Mb 16Mb 16Mb
Voltage 1.8V 1.8V 1.8V 1.8V
Package TFBGA TFBGA TFBGA TFBGA
Package Size 8 x 10 x 1.2 8 x 10 x 1.2 8 x 10 x 1.2 8 x 10 x 1.2
Pin Count 88-ball 88-ball 88-ball 88-ball
Package Type Green Green Green Green
Op. Temp. -40C to +85C -40C to +85C -40C to +85C -40C to +85C
NOR Family W-Series W-Series W-Series W-Series
Configuration Top Boot Bottom Boot Top Boot Top Boot
RoHS Yes Yes Yes Yes

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT38W1011A90YZQXZI.XB8 Contact Factory N/A N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors