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M39L0R8090U3ZE6E

Data Sheets (1)

Data Sheet
JYF8; M39L0R8090U3ZE6E; 128 or 256Mb NOR Flash + 128 or 512Mb DDR LPSDRAM
  • File Type: PDF
  • Updated: 09/2013

Specs

Orderable Parts for: M39L0R8090U3ZE6E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
M39L0R8090U3ZE6E Obsolete Dry Pack N/A N/A N/A No N/A
Detailed Specifications
Part Status Obsolete NOR Density 256Mb DRAM Type LPDDR DRAM Density 512Mb
Voltage 1.8V Package VFBGA Package Size 8 x 8 Pin Count 133-ball
Package Type Green Op. Temp. -40C to +85C NOR Family L-Series Configuration Uniform
RoHS Yes

Sim Models & Software

Sim Models
IBIS

M39L0R8090U3ZE6E, 256Mb NOR Flash + 512Mb LPDDR, MCP, BGA133

  • File Type: ZIP
  • Updated: 10/02/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All NOR Based MCP Documentation
Technical Notes
Search (1) NOR Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
M39L0R8090U3ZE6E Obsolete Dry Pack N/A N/A N/A No N/A
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