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MT29C1G12MAADAFAMD-6 IT

Data Sheets (1)

Specs

Orderable Parts for: MT29C1G12MAADAFAMD-6 IT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29C1G12MAADAFAMD-6 IT Obsolete N/A JW663 N/A N/A No N/A
Detailed Specifications
Part Status Code Obsolete NAND Density 1Gb DRAM Type LPSDR DRAM Density 512Mb
Bus Width x8 Secondary Bus Width x32 RoHS Yes Voltage 1.7V-1.9V
Package VFBGA Pin Count 130-ball Clock Rate 166 MHz Operating Temp -40C to +85C

Sim Models & Software

Sim Models
HSpice
HSpice: J49J (ZIP)

Rev 1.4

  • File Type: ZIP
  • Updated: 05/19/2011
IBIS
IBIS: J49J (ZIP)

Rev 1.4

  • File Type: ZIP
  • Updated: 05/19/2011

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

  • File Type: PDF
  • Updated: 01/08/2016
Search (2) NAND-Based MCP Customer Service Note

Parts with the same Data Sheet (2)

MT29C1G12MAADAFAMD-6 IT ( Current ) MT29C1G12MAACAEAMD-6 IT MT29C1G12MAACAFAMD-6 IT
Part Status Code Obsolete Obsolete Obsolete
NAND Density 1Gb 1Gb 1Gb
DRAM Type LPSDR LPSDR LPSDR
DRAM Density 512Mb 512Mb 512Mb
Bus Width x8 x8 x8
Secondary Bus Width x32 x32 x32
RoHS Yes Yes Yes
Voltage 1.7V-1.9V 1.7V-1.9V 1.7V-1.9V
Package VFBGA VFBGA VFBGA
Pin Count 130-ball 130-ball 130-ball
Clock Rate 166 MHz 166 MHz 166 MHz
Operating Temp -40C to +85C -40C to +85C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29C1G12MAADAFAMD-6 IT Obsolete N/A JW663 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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