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MT29RZ4B2DZZHHTB-18I

Data Sheets (1)

Data Sheet
J80F; MT29RZ4B2DZZHHTB-18W.80F, MT29RZ4B2DZZHHTB-18I.80F
  • File Type: PDF
  • Updated: 06/2016

Specs

Orderable Parts for: MT29RZ4B2DZZHHTB-18I
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ4B2DZZHHTB-18I.80F Production N/A JYA37 N/A N/A No N/A
Detailed Specifications
Part Status Code Production NAND Density 4Gb DRAM Type LPDDR2 DRAM Density 2Gb
Bus Width x32 Secondary Bus Width x32 RoHS Yes Voltage 1.8V
Package VFBGA Pin Count 162-ball Clock Rate 533 MHz Operating Temp -40C to +85C

Sim Models & Software

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

  • File Type: PDF
  • Updated: 01/08/2016
Search (2) NAND-Based MCP Customer Service Note

Parts with the same Data Sheet (1)

MT29RZ4B2DZZHHTB-18I ( Current ) MT29RZ4B2DZZHHTB-18W
Part Status Code Production Production
NAND Density 4Gb 4Gb
DRAM Type LPDDR2 LPDDR2
DRAM Density 2Gb 2Gb
Bus Width x32 x32
Secondary Bus Width x32 x32
RoHS Yes Yes
Voltage 1.8V 1.8V
Package VFBGA VFBGA
Pin Count 162-ball 162-ball
Clock Rate 533 MHz 533 MHz
Operating Temp -40C to +85C -25C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ4B2DZZHHTB-18I.80F Production N/A JYA37 N/A N/A No N/A
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