logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT29RZ2B2DZZHHTB-18W

Data Sheets (1)

Data Sheet
MT29RZ2B2DZZHHTB-18I.88F, MT29RZ2B2DZZHHTB-18W.88F (J88F)
  • File Type: PDF
  • Updated: 09/2016

Specs

Orderable Parts for: MT29RZ2B2DZZHHTB-18W
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ2B2DZZHHTB-18W.88F Sampling N/A JYA21 N/A N/A No N/A
Detailed Specifications
Part Status Code Sampling NAND Density DRAM Type LPDDR2 DRAM Density
Bus Width Secondary Bus Width RoHS Yes Voltage 1.8V
Package VFBGA Pin Count 162-ball Clock Rate Operating Temp

Sim Models & Software

Sim Models
IBIS

J88F; MT29RZ2B2DZZHHTB-18 I.88F, MT29RZ2B2DZZHHTB-18 W.88F

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

Search (2) NAND-Based MCP Customer Service Note

Parts with the same Data Sheet (1)

MT29RZ2B2DZZHHTB-18W ( Current ) MT29RZ2B2DZZHHTB-18I
Part Status Code Sampling Sampling
NAND Density
DRAM Type LPDDR2 LPDDR2
DRAM Density
Bus Width
Secondary Bus Width
RoHS Yes Yes
Voltage 1.8V 1.8V
Package VFBGA VFBGA
Pin Count 162-ball 162-ball
Clock Rate
Operating Temp

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ2B2DZZHHTB-18W.88F Sampling N/A JYA21 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors