logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT29RZ2B1DZZHGSP-25W

Specs

Orderable Parts for: MT29RZ2B1DZZHGSP-25W
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ2B1DZZHGSP-25W.418 Contact Factory N/A JWA33 N/A N/A No N/A
Detailed Specifications
Part Status Code Contact Factory NAND Density 2Gb DRAM Type LPDDR2 DRAM Density 1Gb
Bus Width x8 Secondary Bus Width x32 RoHS Yes Voltage 1.8V
Package WFBGA Pin Count 162-ball Clock Rate 400 MHz Operating Temp -25C to +85C

Sim Models & Software

Sim Models
IBIS

162-Ball, 2Gb NAND 34nm + 1Gb Elpida LPDDR2 30nm

  • File Type: ZIP
  • Updated: 05/20/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

Search (2) NAND-Based MCP Customer Service Note

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ2B1DZZHGSP-25W.418 Contact Factory N/A JWA33 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors