logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT29RZ1CVCZZHGTN-18 I

Specs

Orderable Parts for: MT29RZ1CVCZZHGTN-18 I
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ1CVCZZHGTN-18 I.85H Production N/A JYA14 N/A N/A No N/A
Detailed Specifications
Part Status Code Production NAND Density 1Gb DRAM Type LPDDR2 DRAM Density 512Mb
Bus Width x16 Secondary Bus Width x16 RoHS Yes Voltage 1.8V
Package WFBGA Pin Count 121-ball Clock Rate 533 MHz Operating Temp -40C to +85C

Sim Models & Software

Sim Models
IBIS

J85H; MT29RZ1CVCZZHGTN-18 I.85H, MT29RZ1CVCZZHGTN-18 W.85H

  • File Type: ZIP
  • Updated: 07/11/2016

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

Search (2) NAND-Based MCP Customer Service Note

Parts with the same Data Sheet (1)

MT29RZ1CVCZZHGTN-18 I ( Current ) MT29RZ1CVCZZHGTN-18 W
Part Status Code Production Production
NAND Density 1Gb 1Gb
DRAM Type LPDDR2 LPDDR2
DRAM Density 512Mb 512Mb
Bus Width x16 x16
Secondary Bus Width x16 x16
RoHS Yes Yes
Voltage 1.8V 1.8V
Package WFBGA WFBGA
Pin Count 121-ball 121-ball
Clock Rate 533 MHz 533 MHz
Operating Temp -40C to +85C -25C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29RZ1CVCZZHGTN-18 I.85H Production N/A JYA14 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors