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MT29C4G96MAYBACKD-5 WT

Data Sheets (1)

Data Sheet
J4P2, J4X2, J4X3; TFBGA137, VFBGA137
  • File Type: PDF
  • Updated: 04/2013

Specs

Orderable Parts for: MT29C4G96MAYBACKD-5 WT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29C4G96MAYBACKD-5 WT Obsolete N/A JW731 N/A N/A No N/A
Detailed Specifications
Part Status Code Obsolete NAND Density 4Gb DRAM Type LPDDR DRAM Density 4Gb
Bus Width x8 Secondary Bus Width x32 RoHS Yes Voltage 1.7V-1.9V
Package TFBGA Pin Count 137-ball Clock Rate 200 MHz Operating Temp -25C to +85C

Sim Models & Software

Sim Models
IBIS
  • File Type: ZIP
  • Updated: 08/14/2014
HSpice
HSpice (ZIP)

Rev 2.0

  • File Type: ZIP
  • Updated: 08/14/2014

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

Search (2) NAND-Based MCP Customer Service Note

Parts with the same Data Sheet (5)

MT29C4G96MAYBACKD-5 WT ( Current ) MT29C4G96MAZBACKD-5 WT MT29C8G96MAZBADKD-5 IT MT29C8G96MAZBADKD-5 WT MT29C4G48MAYBAAKS-5 WT MT29C4G48MAZBAAKS-5 WT
Part Status Code Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
NAND Density 4Gb 4Gb 8Gb 8Gb 4Gb 4Gb
DRAM Type LPDDR LPDDR LPDDR LPDDR LPDDR LPDDR
DRAM Density 4Gb 4Gb 4Gb 4Gb 2Gb 2Gb
Bus Width x8 x16 x16 x16 x8 x16
Secondary Bus Width x32 x32 x32 x32 x16 x16
RoHS Yes Yes Yes Yes Yes Yes
Voltage 1.7V-1.9V 1.7V-1.9V 1.7V-1.9V 1.7V-1.9V 1.7V-1.9V 1.7V-1.9V
Package TFBGA TFBGA TFBGA TFBGA VFBGA VFBGA
Pin Count 137-ball 137-ball 137-ball 137-ball 137-ball 137-ball
Clock Rate 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Operating Temp -25C to +85C -25C to +85C -40C to +85C -25C to +85C -25C to +85C -25C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29C4G96MAYBACKD-5 WT Obsolete N/A JW731 N/A N/A No N/A
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