logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT29C1G12MAAIYAMR-5 AIT

Data Sheets (1)

Data Sheet
J4MK; MT29C1G12MAAIVAMD-5 IT, MT29C1G12MAAIYAMD-5 IT, MT29C1G12MAAJVAMD-5 IT, MT29C1G12MAAJYAMD-5 IT, MT29C1G12MAAIYAMR-5 AIT
  • File Type: PDF
  • Updated: 10/2015

Specs

Orderable Parts for: MT29C1G12MAAIYAMR-5 AIT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29C1G12MAAIYAMR-5 AIT Production N/A JWC03 N/A N/A No N/A
Detailed Specifications
Part Status Code Production NAND Density 1Gb DRAM Type LPDDR DRAM Density 512Mb
Bus Width x8 Secondary Bus Width x32 RoHS Yes Voltage 1.7V-1.9V
Package VFBGA Pin Count 130-ball Clock Rate 200 MHz Operating Temp -40C to +85C

Sim Models & Software

Sim Models
IBIS
IBIS: J4MK (ZIP)

NAND Flash + LPDDR MCP; MT29C1G12MAAIYAMR-5 AIT, MT29C1G12MAAIVAMD-5 IT, MT29C1G12MAAIYAMD-5 IT, MT29C1G12MAAJVAMD-5 IT, MT29C1G12MAAJYAMD-5 IT, MT29C1G12MAAJVAKC-5 IT

  • File Type: ZIP
  • Updated: 02/23/2015

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 10/2017
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 10/2017

Documentation & Support

See All NAND-Based MCP Documentation
Technical Notes
Search (2) NAND-Based MCP Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-10-08) This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to...

  • File Type: PDF
  • Updated: 07/26/2010
Search (2) NAND-Based MCP Technical Notes

Customer Service Note

Customer Service Note
Customer Service Note


(CSN-16) Explanation of Micron packaging labels and procedures.

  • File Type: PDF
  • Updated: 09/29/2017
Customer Service Note


(CSN-34) Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • File Type: PDF
  • Updated: 05/16/2016
Search (2) NAND-Based MCP Customer Service Note

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29C1G12MAAIYAMR-5 AIT Production N/A JWC03 N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors