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MT48LC4M32B2P-6A AIT

Data Sheets (1)

Data Sheet
MT48LC4M32B2 – 1 Meg x 32 x 4 Banks
  • File Type: PDF
  • Updated: 06/2018

Specs

Orderable Parts for: MT48LC4M32B2P-6A AIT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT48LC4M32B2P-6A AIT:L Production N/A D9NRT N/A N/A No N/A
Detailed Specifications
Density 128Mb Part Status Production RoHS Yes Depth 4Mb
Width x32 Voltage 3.3V Package TSOP Pin Count 86-pin
Clock Rate 166 MHz Cycle Time 6ns Op. Temp. -40C to +85C CL CL = 3
Data Rate PC133

Sim Models & Software

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All SDRAM Documentation
Technical Notes
Search (7) SDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-00-24) This technical note compares the I/O characteristics of the 54nm to the 130nm single data rate (SDR) synchronous dynamic random access memory (SDRAM) die.

  • File Type: PDF
  • Updated: 05/25/2011
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (6)

MT48LC4M32B2P-6A AIT ( Current ) MT48LC4M32B2B5-6A AIT MT48LC4M32B2P-6A AAT MT48LC4M32B2B5-6A AAT MT48LC4M32B2P-6A AAT MT48LC4M32B2P-6A IT MT48LC4M32B2F5-6A IT
Part Status Production Production Production Production Production Production Obsolete
Density 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb
RoHS Yes Yes Yes Yes Yes Yes 5/6
Depth 4Mb 4Mb 4Mb 4Mb 4Mb 4Mb 4Mb
Width x32 x32 x32 x32 x32 x32 x32
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Package TSOP VFBGA TSOP VFBGA TSOP TSOP VFBGA
Pin Count 86-pin 90-ball 86-pin 90-ball 86-pin 86-pin 90-ball
Clock Rate 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz
Cycle Time 6ns 6ns 6ns 6ns 6ns 6ns 6ns
Op. Temp. -40C to +85C -40C to +85C -40C to +105C -40C to +105C -40C to +105C -40C to +85C -40C to +85C
CL CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3
Data Rate PC133 PC133 PC133 PC133 PC133 PC133 PC133

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT48LC4M32B2P-6A AIT:L Production N/A D9NRT N/A N/A No N/A
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Check with Distributors
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