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MT48LC32M16A2TG-75 IT

Data Sheets (1)

Data Sheet
  • File Type: PDF
  • Updated: 05/2015

Specs

Orderable Parts for: MT48LC32M16A2TG-75 IT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT48LC32M16A2TG-75 IT:C EOL N/A N/A N/A N/A No N/A
Detailed Specifications
Density 512Mb Part Status End of Life RoHS 5/6 Depth 32Mb
Width x16 Voltage 3.3V Package TSOP Pin Count 54-pin
Clock Rate 133 MHz Cycle Time 7.5ns Op. Temp. -40C to +85C CL CL = 3
Data Rate PC133

Sim Models & Software

Sim Models
Verilog
  • File Type: ZIP
  • Updated: 05/12/2016
HSpice
HSpice (ZIP)

2.3

  • File Type: ZIP
  • Updated: 04/14/2004
IBIS
IBIS (ZIP)

2.4

  • File Type: ZIP
  • Updated: 04/14/2004
Verilog
Verilog (ZIP)

  • File Type: ZIP
  • Updated: 06/05/2002

RoHS Certificates

RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 07/2018

Documentation & Support

See All SDRAM Documentation
Technical Notes
Search (7) SDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-00-24) This technical note compares the I/O characteristics of the 54nm to the 130nm single data rate (SDR) synchronous dynamic random access memory (SDRAM) die.

  • File Type: PDF
  • Updated: 05/25/2011
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (2)

MT48LC32M16A2TG-75 IT ( Current ) MT48LC64M8A2P-75 IT MT48LC64M8A2TG-75 IT
Part Status End of Life End of Life Contact Factory
Density 512Mb 512Mb 512Mb
RoHS 5/6 Yes 5/6
Depth 32Mb 64Mb 64Mb
Width x16 x8 x8
Voltage 3.3V 3.3V 3.3V
Package TSOP TSOP TSOP
Pin Count 54-pin 54-pin 54-pin
Clock Rate 133 MHz 133 MHz 133 MHz
Cycle Time 7.5ns 7.5ns 7.5ns
Op. Temp. -40C to +85C -40C to +85C -40C to +85C
CL CL = 3 CL = 3 CL = 3
Data Rate PC133 PC133 PC133

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT48LC32M16A2TG-75 IT:C EOL N/A N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors