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MT46H128M32L2KQ-48 WT

Data Sheets (1)

Data Sheet
MT46H128M16LF, MT46H64M32LF
  • File Type: PDF
  • Updated: 05/2018

Specs

Orderable Parts for: MT46H128M32L2KQ-48 WT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT46H128M32L2KQ-48 WT:C EOL N/A JWC16 N/A N/A No N/A
Detailed Specifications
Technology LPDDR Density 4Gb Part Status End of Life RoHS Yes
Depth 128Mb Width x32 Voltage 1.8V Package WFBGA
Pin Count 168-ball Clock Rate 208 MHz Data Rate LPDDR416 Cycle Time 5ns
Op. Temp. -25C to +85C Brand Micron

Sim Models & Software

Sim Models
IBIS
IBIS (ZIP)

Die Rev. C

  • File Type: ZIP
  • Updated: 11/21/2014

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(E0597E10) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (8)

MT46H128M32L2KQ-48 WT ( Current ) MT46H64M32LFBQ-48 AIT MT46H64M32LFBQ-48 IT MT46H128M16LFDD-48 AIT MT46H128M16LFDD-48 IT MT46H128M16LFDD-48 WT MT46H128M32L2KQ-48 IT MT46H64M32LFKQ-5 IT MT46H256M32L4LE-48 WT
Part Status End of Life Production Production Production Production Production End of Life End of Life End of Life
Technology LPDDR LPDDR LPDDR LPDDR LPDDR LPDDR LPDDR LPDDR LPDDR
Density 4Gb 2Gb 2Gb 2Gb 2Gb 2Gb 4Gb 2Gb 8Gb
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes
Depth 128Mb 64Mb 64Mb 128Mb 128Mb 128Mb 128Mb 64Mb 256Mb
Width x32 x32 x32 x16 x16 x16 x32 x32 x32
Voltage 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V
Package WFBGA VFBGA VFBGA VFBGA VFBGA VFBGA WFBGA WFBGA VFBGA
Pin Count 168-ball 90-ball 90-ball 60-ball 60-ball 60-ball 168-ball 168-pin 168-ball
Clock Rate 208 MHz 208 MHz 208 MHz 208 MHz 208 MHz 208 MHz 208 MHz 200 MHz 208 MHz
Data Rate LPDDR416 LPDDR416 LPDDR416 LPDDR416 LPDDR416 LPDDR416 LPDDR416 LPDDR400 LPDDR416
Cycle Time 5ns 5ns 5ns 5ns 5ns 5ns 5ns 5ns 5ns
Op. Temp. -25C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -25C to +85C -40C to +85C -40C to +85C -25C to +85C
Brand Micron Micron Micron Micron Micron Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT46H128M32L2KQ-48 WT:C EOL N/A JWC16 N/A N/A No N/A
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