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MT52L256M64D2GN-107 WT

Data Sheets (1)

Data Sheet
DDP, QDP, 14x14, MT52L256M64D2GN-107 WT:B, MT52L256M64D4GN-107 WT :B, MT52L256M64D2FT-107 WT :B
  • File Type: PDF
  • Updated: 04/2018


Orderable Parts for: MT52L256M64D2GN-107 WT
Status Media FBGA Code SPD Data Chipset
PLP Start Date Alternative Part
MT52L256M64D2GN-107 WT:B Contact Factory N/A D9TBD N/A N/A No N/A
Detailed Specifications
Technology LPDDR3 Density 16Gb Part Status Contact Factory RoHS Yes
Depth 256Mb Width x64 Voltage 1.2V Package WFBGA
Pin Count 256-ball Clock Rate 933 MHz Data Rate DDR3-1866 Cycle Time 1.071ns
Op. Temp. -30C to +85C Brand Micron

Sim Models & Software

Sim Models

Rev 1.5_XT/WT, Rev 1.2_IT, Die, 168-Ball, 178-Ball, 256-Ball, 253-Ball, 216-Ball, SDP, DDP, TDP, QDP, 8DP, LPDDR3 SDRAM

  • File Type: ZIP
  • Updated: 04/25/2018

Verilog simulation model for 8Gb Mobile LPDDR3

  • File Type: ZIP
  • Updated: 12/25/2017

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes

(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes

(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
Customer Service Note

(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018
Customer Service Note

(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (1)

MT52L256M64D2GN-107 WT ( Current ) MT52L512M64D4GN-107 WT
Part Status Contact Factory Production
Technology LPDDR3 LPDDR3
Density 16Gb 32Gb
RoHS Yes Yes
Depth 256Mb 512Mb
Width x64 x64
Voltage 1.2V 1.2V
Pin Count 256-ball 256-ball
Clock Rate 933 MHz 933 MHz
Data Rate DDR3-1866 DDR3-1866
Cycle Time 1.071ns 1.071ns
Op. Temp. -30C to +85C -30C to +85C
Brand Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
PLP Start Date Alternative Part
MT52L256M64D2GN-107 WT:B Contact Factory N/A D9TBD N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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