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EDFP112A3PF-GDTJ-F

Data Sheets (1)

Data Sheet
504-Ball, QDP, Quad-Channel, LPDDR3 SDRAM (Zht=0.7mm)
  • File Type: PDF
  • Updated: 02/2015

Specs

Orderable Parts for: EDFP112A3PF-GDTJ-F
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFP112A3PF-GDTJ-F-D Obsolete N/A N/A N/A N/A No N/A
EDFP112A3PF-GDTJ-F-R Obsolete N/A N/A N/A N/A No N/A
Detailed Specifications
Technology LPDDR3 Density 24Gb Part Status Obsolete RoHS Yes
Depth 192Mb Width x128 Voltage 1.2V Package WFBGA
Pin Count 504-ball Clock Rate 800 MHz Data Rate DDR3-1600 Cycle Time
Op. Temp. -30C to +105C Brand Micron

Sim Models & Software

Sim Models
Verilog

Verilog simulation model for 6Gb Mobile LPDDR3

  • File Type: ZIP
  • Updated: 01/23/2018

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(E0597E10) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (3)

EDFP112A3PF-GDTJ-F ( Current ) EDFP112A3PF-GD-F EDFP112A3PF-JD-F EDFP112A3PF-JDTJ-F
Part Status Obsolete Obsolete End of Life Contact Factory
Technology LPDDR3 LPDDR3 LPDDR3 LPDDR3
Density 24Gb 24Gb 24Gb 24Gb
RoHS Yes Yes Yes Yes
Depth 192Mb 192Mb 192Mb 192Mb
Width x128 x128 x128 x128
Voltage 1.2V 1.2V 1.2V 1.2V
Package WFBGA WFBGA WFBGA WFBGA
Pin Count 504-ball 504-ball 504-ball 504-ball
Clock Rate 800 MHz 800 MHz 933 MHz 933 MHz
Data Rate DDR3-1600 DDR3-1600 DDR3-1866 DDR3-1866
Cycle Time
Op. Temp. -30C to +105C -30C to +85C -30C to +85C -30C to +105C
Brand Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFP112A3PF-GDTJ-F-D Obsolete N/A N/A N/A N/A No N/A
EDFP112A3PF-GDTJ-F-R Obsolete N/A N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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