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EDFM432A1PF-GD-F

Data Sheets (1)

Data Sheet
216-Ball, 12x12, DDP, 3DP, QDP, Single-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 10/2014

Specs

Orderable Parts for: EDFM432A1PF-GD-F
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFM432A1PF-GD-F-D Production Dry Pack N/A N/A N/A No N/A
EDFM432A1PF-GD-F-R Production Tape & Reel N/A N/A N/A No N/A
Detailed Specifications
Technology LPDDR3 Density 12Gb Part Status Production RoHS Yes
Depth 384Mb Width x32 Voltage 1.2V Package WFBGA
Pin Count 216-ball Clock Rate 800 MHz Data Rate DDR3-1600 Cycle Time
Op. Temp. -30C to +85C Brand Micron

Sim Models & Software

Sim Models
IBIS

Rev 1.0 216-Ball, 3DP, Single-Channel, LPDDR3 SDRAM

  • File Type: ZIP
  • Updated: 09/02/2014

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 12/2016
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 12/2016

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(E0597E10) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(E0599E20) This technical note describes Auto Temperature Compensated Self Refresh (ATCSR), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-46-23) This technical note reviews the timing differences between the faster and slower LPDDR SDRAM speeds and explains how faster parts function compatibly with slower parts.

  • File Type: PDF
  • Updated: 02/04/2013
Search (9) LPDRAM Technical Notes

Parts with the same Data Sheet (5)

EDFM432A1PF-GD-F ( Current ) EDFA232A2PB-JD-F EDFA232A2PB-GD-F EDF8132A3PB-GD-F EDF8132A3PB-JD-F EDFM432A1PF-JD-F
Part Status Production Production Production Production Production Production
Technology LPDDR3 LPDDR3 LPDDR3 LPDDR3 LPDDR3 LPDDR3
Density 12Gb 16Gb 16Gb 8Gb 8Gb 12Gb
RoHS Yes Yes Yes Yes Yes Yes
Depth 384Mb 512Mb 512Mb 256Mb 256Mb 384Mb
Width x32 x32 x32 x32 x32 x32
Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V
Package WFBGA VFBGA VFBGA WFBGA WFBGA WFBGA
Pin Count 216-ball 216-ball 216-ball 216-ball 216-ball 216-ball
Clock Rate 800 MHz 933 MHz 800 MHz 800 MHz 933 MHz 933 MHz
Data Rate DDR3-1600 DDR3-1866 DDR3-1600 DDR3-1600 DDR3-1866 DDR3-1866
Cycle Time
Op. Temp. -30C to +85C -30C to +85C -30C to +85C -30C to +85C -30C to +85C -30C to +85C
Brand Micron Micron Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFM432A1PF-GD-F-D Production Dry Pack N/A N/A N/A No N/A
EDFM432A1PF-GD-F-R Production Tape & Reel N/A N/A N/A No N/A
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