logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

EDFA164A2PK-JD-F

Data Sheets (1)

Data Sheet
216-Ball, 12x12, DDP, 3DP, QDP, Dual-Channel, LPDDR3 SDRAM
  • File Type: PDF
  • Updated: 10/2014

Specs

Orderable Parts for: EDFA164A2PK-JD-F
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFA164A2PK-JD-F-D Obsolete Dry Pack N/A N/A N/A No N/A
EDFA164A2PK-JD-F-R Obsolete N/A N/A N/A N/A No N/A
Detailed Specifications
Technology LPDDR3 Density 16Gb Part Status Obsolete RoHS Yes
Depth 256Mb Width x64 Voltage 1.2V Package WFBGA
Pin Count 216-ball Clock Rate 933 MHz Data Rate DDR3-1866 Cycle Time
Op. Temp. -30C to +85C Brand Micron

Sim Models & Software

Sim Models
Verilog

Verilog simulation model for 4Gb Mobile LPDDR3

  • File Type: ZIP
  • Updated: 01/23/2018
IBIS

Rev 1.0 216-Ball, 12 x 12, QDP, Dual-Channel, LPDDR3 SDRAM

  • File Type: ZIP
  • Updated: 09/02/2014

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (2)

EDFA164A2PK-JD-F ( Current ) EDF8164A3PK-GD-F EDFA164A2PK-GD-F
Part Status Obsolete End of Life Obsolete
Technology LPDDR3 LPDDR3 LPDDR3
Density 16Gb 8Gb 16Gb
RoHS Yes Yes Yes
Depth 256Mb 128Mb 256Mb
Width x64 x64 x64
Voltage 1.2V 1.2V 1.2V
Package WFBGA WFBGA WFBGA
Pin Count 216-ball 256-ball 216-ball
Clock Rate 933 MHz 800 MHz 800 MHz
Data Rate DDR3-1866 DDR3-1600 DDR3-1600
Cycle Time
Op. Temp. -30C to +85C -30C to +85C -30C to +85C
Brand Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFA164A2PK-JD-F-D Obsolete Dry Pack N/A N/A N/A No N/A
EDFA164A2PK-JD-F-R Obsolete N/A N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors