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EDFA112A2PD-GD-F

Specs

Orderable Parts for: EDFA112A2PD-GD-F
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFA112A2PD-GD-F-D Contact Factory Dry Pack N/A N/A N/A No N/A
EDFA112A2PD-GD-F-R Obsolete Tape & Reel N/A N/A N/A No N/A
Detailed Specifications
Technology LPDDR3 Density 16Gb Part Status End of Life RoHS Yes
Depth 128Mb Width x128 Voltage 1.2V Package UFBGA
Pin Count 504-ball Clock Rate 800 MHz Data Rate DDR3-1600 Cycle Time
Op. Temp. -30C to +85C Brand Micron

Sim Models & Software

Sim Models
Verilog

Verilog simulation model for 4Gb Mobile LPDDR3

  • File Type: ZIP
  • Updated: 01/23/2018

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(E0597E10) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDFA112A2PD-GD-F-D Contact Factory Dry Pack N/A N/A N/A No N/A
EDFA112A2PD-GD-F-R Obsolete Tape & Reel N/A N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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