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ECF440AAACN-Y3

Specs

Orderable Parts for: ECF440AAACN-Y3
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
ECF440AAACN-Y3 Obsolete DIE/WAFER N/A N/A N/A No N/A
Detailed Specifications
Technology Density Part Status Obsolete RoHS
Depth Width Voltage Package
Pin Count Clock Rate Data Rate Cycle Time
Op. Temp. Brand Micron

Sim Models & Software

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (3) LPDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-00-19) This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.

  • File Type: PDF
  • Updated: 10/15/2009
Technical Notes


(TN-46-12) This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.

  • File Type: PDF
  • Updated: 05/16/2009
Search (3) LPDRAM Technical Notes

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
ECF440AAACN-Y3 Obsolete DIE/WAFER N/A N/A N/A No N/A
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